A continuous electroplating model for poorly conductive substrates

Dianlong Wang,Changsong Dai,Erhan Hai,Zhaohua Jiang
2005-01-01
Abstract:In order to control the distribution of the current density during continuous electroplating on poorly conductive metal foils and metal foam strips, a mathematical model for this process and a formula for calculating the geometric forms of the anode are described. This model can be applied to the continuous electroplating of nickel on a conductive sponge and can enhance the tensile strength and uniformity of nickel foam.
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