An in-situ technique for measuring young's modulus and residual stress of each layer for multi-layer film

Meng Nie,QingAn Huang,Weihua Li,Hua Rong
DOI: https://doi.org/10.1109/sensor.2005.1496547
2005-01-01
Abstract:This paper presents an approach to characterize the material properties of the multi-layered films using the electrostatic pull-in test structure. The structure is composed of the multi-layered fixed-fixed beam with different widths. An analytical model for the pull-in voltage of the multi-layered fixed-fixed beam with different widths is first presented. The model is then fitted by using the numerical analysis to improve further its accuracy. Based on this model, a novel in-situ method for simultaneously extracting Young's modulus and residual stress of each layer for the multi-layered films is reported. Validation and accuracy of the extracting method have been confirmed by FEM simulation and experiments.
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