Abstract:Electroless nickel-phosphorus workpieces undergo a variety of surface/subsurface deformations and internal organizational changes throughout the nano-cutting process that have a major impact on the machining quality of microstructured functional surfaces. In this paper, molecular dynamics simulations were performed for nano-cutting of electroless nickel-phosphorus (Ni–P) workpieces obtained at different cooling rates (1e11 K/s, 1e12 K/s, 1e13 K/s). To research the mechanisms of material removal and surface formation during nano-cutting, the impacts of various cutting depths on atomic ordering, cutting force, cutting temperature, shear strain, material pile-up, and surface shape were examined. The simulations showed that material removal of NiP coatings was mainly based on nanoscale extrusion rather than macroscale shear. The radial distribution function of NiP coatings was dominated by the Ni–P pair, the cutting force of the nano-cutting process was more stable, the thrust force was smaller, and the machined surface roughness Ra was smaller when the cooling rate was higher. However, the number of atoms on the upper surface of the workpiece increased more, and the actual machined surface contour line deviated from the ideal surface contour when the cooling rate was faster. To increase the forming accuracy of the machined surface on NiP without destroying the machined surface roughness, the cooling rate must be slowed appropriately for the NiP alloy to form a tiny amount of crystalline organization or to minimize the nano-cutting depth.

Variations of a Ni-P Surface Layer after Nanoparticle Impacts

Nano-deformation of a Ni–P coating surface after nanoparticle impacts

Variation of Surface Layer During Chemical Mechanical Polish

The variation in surface layer in CMP

Mechanical Model of Nanoparticles for Material Removal in Chemical Mechanical Polishing Process

Atomic scale deformation in the solid surface induced by nanoparticle impacts

Effect of Nanoparticle Impact on Material Removal

Influences of the Viscosity of Slurry on Monocrystalline Silicon Surface Damage Caused by Nanoparticle Impact

Concurrent transitions in wear rate and surface microstructure in nanocrystalline Ni-W

Mode Transition from Adsorption Removal to Bombardment Removal Induced by Nanoparticle-Surface Collisions in Fluid Jet Polishing

Monoatomic Layer Removal Mechanism in Chemical Mechanical Polishing Process: A Molecular Dynamics Study

Impact-sliding wear properties of PVD CrN and WC/C coatings

Molecular dynamics simulation of the nano-cutting mechanism of a high-phosphorus NiP coating

XPS and AFM study of chemical mechanical polishing of silicon nitride

Nano Particles’ Behavior in Non-Newtonian Slurry in Mechanical Process of CMP

Novel three-body nano-abrasive wear mechanism

Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon

Wear phenomena in chemical mechanical polishing

Nano Particles’ Behavior in Chemical Mechanical Polishing With the Effect of Non-Newtonian Properties of Slurry

The crystallographic change in sub-surface layer of the silicon single crystal polished by chemical mechanical polishing

Wear behavior of graded nickel-phosphorus coatings with a medium phosphorus top layer: An experimental and molecular dynamics simulation study