Motion Analysis for Double-Sided Polishing Process and Mathematical Model Establishing

Yang-fu JIN,Wei LI,Gang-xiang HU,Xiao-zhen HU
DOI: https://doi.org/10.3969/j.issn.1005-2615.2005.z1.019
2005-01-01
Abstract:Double-sided polishing process is a precise machining method for silicon wafers. It has the characteristics of the multi-directional motion, the complicated load and the tiny material removal. The wafer motion and the load in double-sided polishing process are main factors which affect the wafer surface quality. This paper discusses the wafer motion and the load in the double-sided polishing process, and establishes a mathematical model based on the analysis of the motion and the load in wafers. The result shows that the motion of wafers is composed of the planet motion and the axial rotation motion. And the axial rotation speed of wafers is independent of the polishing pressure and the friction state between polishing pad and wafer surfaces, but it is related to the friction state between the planet wheel and the wafer edge, motion parameters of the planet wheel system, and the rotation speed of the polishing plate, when the mass and the moment of the wafer inertia are small to be ignored.
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