Abstract:The Cu nanowires were prepared in alumina membranes with ordered pore arrays by an electrochemical deposition. X-ray diffraction and scan electron microscopy were employed to characterize the nanowires. The results show that the nanowires are located in the channels of the alumina membrane with a diameter of about 40 nm along the [110] direction. The thermal expansion coefficients of the nanowires were measured by in situ high-resolution x-ray diffraction in the temperature range from 298 to 693 K. The results show that the Cu nanowires possess larger lattice parameters and smaller thermal expansion coefficient compared with the conventional bulk Cu. This is because the nanowires consist of a crystalline component and grain boundaries. The grain boundaries usually contain vacancies and vacancy clusters, so they have a larger thermal expansion coefficient than the crystalline component. With elevating temperature, the vacancies and vacancy clusters disappeared and a small thermal expansion coefficient of the Cu nanowires was observed. The high thermal stability of the Cu nanowires is very important for designing nanoelectronic devices and reforming properties of the cermet.

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