Bonding strength of the Ag/Cu bimetallic strips prepared by roll bonding at different temperatures

Fang Yan,Liang Meng,Shiping Zhou,Futao T. Yang,Qijie J. Shen
DOI: https://doi.org/10.3321/j.issn:1002-185x.2003.07.013
2003-01-01
Rare Metal Materials and Engineering
Abstract:The Ag/Cu bimetallic strips were prepared by roll bonding at different temperatures. The effecs of roll temperature on the bonding strength under the condition of peeling load were investigated. The hardness of the strip matrixes was determined and the morphology of the peeling surfaces was observed. The large connecting area by the metallurgical reaction on the peeling surfaces of the laminated strips bonded at 350degreesC results in a high bonding strength. The connected area by the metallurgical reaction decreases when the strips are bonded at the temperature lower than 350degreesC. The metallic surface is seperated by the oxide layer between Ag and Cu when the strips are bonded at the temperature higher than 350degreesC, decreasing the bonding strength in both cases.
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