Effect of Annealing Temperature on Peeling Strength of Ag/Cu Bimetallic Strips

孟亮,张雷,周世平,杨富陶,沈其洁
DOI: https://doi.org/10.3969/j.issn.1009-6264.2002.03.007
2002-01-01
Abstract:The Ag/Cu bimetallic strips bonded by roll process were annealed at different temperatures. The effect of annealing temperature on the peeling strength was investigated and the mechanism responsible for the peeling strength various with annealing temperature was discussed. The peeling strength increases with annealing temperature because of the diffusion of atoms across through the bonding interface and the formation of grain boundaries from recrystallization. The bimetallic strips annealed at 400℃ display high peeling strength. There exist some cavities at the bounding interface to result in reduction of the peeling strength when annealing temperature is further elevated. The peeling strength could slightly be improved if the bimetallic strips are annealed at sintering temperature.
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