Effect of Roll Bonding and Diffusion Treatment Temperature on Bond Properties of Ag/Cu Bimetallic Laminates

孟亮,周世平,杨富陶,沈其洁,刘茂森
DOI: https://doi.org/10.3321/j.issn:1004-0609.2001.06.006
2001-01-01
The Chinese Journal of Nonferrous Metals
Abstract:The Ag/Cu bimetallic laminates were prepared by roll bonding and diffusion treatment at different temperatures. The dependence of the bond properties under the repeatedly bonding condition on the matrix hardness of strip components and the microstructure in interface region was investigated. The bonding and diffusing at optimum temperatures produce the high bond properties because the laminates show full recrystallization, low hardness and tightly bonding interface. Bonding and diffusing to excessively high temperature result in the thick oxide layer on the interface, more pores along the interface and coarse grains in the matrixes Ag and Cu. Consequently, the bond properties may be reduced significantly.
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