PREPARATION AND CHARACTERIZATION OF MnSi1.7 THIN FILMS

ZM Wang,QR Hou,YJ He
DOI: https://doi.org/10.1142/s0217984902004068
2002-01-01
Modern Physics Letters B
Abstract:MnSi1.7 films were prepared by Solid Phase Reaction on Si(100) substrates under UHV conditions. Auger Electron Spectroscopy (AES) and X-ray diffraction (XRD) were used to study the composition and the structure of the MnSix films. Compared with the reactive-deposited MnSi1.7 films on silicon substrates, severe diffusion of manganese atoms into the silicon substrate during the thermal annealing process was observed. If the annealing process was not long enough, the phenomenon of coexistence of manganese-rich and silicon-rich silicides was found. The electrical resistivity of MnSi1.7 films was measured in the temperature range of 30degreesC to 450degreesC. The resistivity increases gradually with temperature in the temperature range measured.
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