A Novel Glycidyl Ether Type Tetrafunctional Epoxy Resin: Synthesis, Cure Kinetic and Properties
An Xing,Chenchen Gao,Peichen Yuan,Yajing Qiao,Longhai Guo,Xiaoyu Li,Wantai Yang
DOI: https://doi.org/10.1080/10601325.2024.2302142
2024-01-01
Abstract:Thermal stable epoxy is indispensable for aerospace and advanced electronic application. As replacements for common thermal stable epoxy TGDDM, we previously developed several glycidyl ether type tetrafunctional epoxies. As a continuous effort to achieve higher T-g, a novel tetrafunctional epoxy with shorter spacer and lower epoxide equivalent weight (TFEP) was synthesized. TFEP was mixed with DGEBA, and cured with MHHPA and DDS, respectively. TFEP increases the T-g and char residues, and reduces the maximum weight loss rate. T-g of 30 wt%TFEP/DGEBA/DDS is higher than that of previously reported epoxies, whereas T-g of 40 wt%TFEP/DGEBA/DDS is comparable to that of TGDDM/DDS. The influences of TFEP on the T-d, strength, toughness, water absorption and free volume are different, depending on the curing agents. Moreover, 30 wt%TFEP/DGEBA/DDS exhibits higher toughness and T-d5%, lower water absorption, and comparable strength, compared with TGDDM/DDS, providing a better replacement for TGDDM. Besides, TFEP slightly increases the E-a.