Reaction Kinetics and Thermal Properties of Epoxidised Cresol Novolac/4,4 '-Diglycidyl (3,3 ',5,5 '-Tetramethylbiphenyl) Epoxy Resin Composite Cured with Aromatic Diamine

Zhongguo Liu,Gang Zhang,Kuifeng Tu,Sen Zhao,Miaomiao Han,Jing Ni,Wenjia Ma,Hui Na
DOI: https://doi.org/10.1002/pi.3119
IF: 3.213
2011-01-01
Polymer International
Abstract:A series of novel composites based on different ratios of epoxidised cresol novolac (ECN) and 4,4'-diglycidyl(3,3',5,5'-tetramethylbiphenyl) epoxy resin (TMBP) have been prepared with the curing agent 4,4'-methylenediamine (DDM) and 4,4'-diaminodiphenylsulfone (DDS), respectively. The investigation of cure kinetics was performed by differential scanning calorimetry using an isoconversional method. The high thermal stabilities of the cured samples were also studied by thermogravimetric analysis. In addition, no phase separation was observed for cured ECN/DDM and ECN/DDS blending with different amounts of TMBP by dynamic mechanical analysis and scanning electron microscopy. Moreover, the cured systems also exhibited excellent impact properties and low moisture absorption. All the results indicate that the ECN/TMBP/DDM and ECN/TMBP/DDS systems are promising materials in electronic packaging. (C) 2011 Society of Chemical Industry
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