Design, Simulation And Evaluation Of Novel Corrugated Diaphragms Based On Backside Sacrificial Layer Etching Technique

J Chen,Lt Liu,Zj Li
DOI: https://doi.org/10.1117/12.444736
2001-01-01
Abstract:A novel single-chip condenser structure consists of a corrugated diaphragm and a backplate is presented using the backside sacrificial layer etching technique. Several kinds of corrugated diaphragms achieved by the anisotropic etch with KOH solution and Inductively Coupled Plasma (ICP) etch have been designed and simulated. An electrostatic-structural coupling FEM analysis was performed using the commercial FEA software ANSYS. The influence of various nonlinear effects on the performance of diaphragms are studied and all the corrugated diaphragms show a sensitivity more than one order larger than that of the flat diaphragm of equal size and thickness. The optimum balance between performance and stability is found.
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