New silicon micromechanical resonant viscosity vacuum gage

Yaqiang Wang,Zhonghe Jin,Yuelin Wang-,Chun Ding

1997-01-01

Abstract:A new type of resonant viscosity vacuum gage based on the silicon micromechanical resonant vacuum sensor by electrostatic excitation was developed. It can measure the pressures over a range from 1 Pa to 1.33��103 Pa. The theoretical analysis and experimental results were presented.

What problem does this paper attempt to address?

Thermally Excited Micromechanical Vacuum Resonator

YQ Wang,ZH Jin,YL Wang,C Ding

DOI: https://doi.org/10.1109/icsict.1998.786540

1998-01-01

Abstract:A micromechanical resonator is proposed and realized. It consists of a single-crystal silicon beam and two P-type silicon resistors. One resistor is used to excite the vibrating beam and the other to sense vibration of the beam. The dimensions of the resonator are about 4/spl times/2.5 mm/sup 2/, the resonant frequency is about 7.8 KHz, Q factor about 190 in air and above 2500 in vacuum degree of 7.5/spl times/10/sup -4/ Pa. The theory of thermal excitation is analyzed and the characteristics of the resonator are tested. We conclude that the resonator can be applied to vacuum measurement by the means of closed-loop resonating circuit. The design and realization of the circuit are described.
Discussion on the optical-coupling in silicon optical-type micromechanical sensors

Ding Chun,Yaqiang Wang,Yuelin Wang-,Zhonghe Jin

DOI: https://doi.org/10.1109/ICSICT.1998.786542

1998-01-01

Abstract:A flow-sensor and a resonator are fabricated on silicon substrate using the micromechanical technology. The devices are with a structure based on a silicon cantilever with waveguide on the surface to detect the movement of the silicon cantilever. The method to couple the laser into the waveguide is discussed and the performance of the fabricated devices are characterized.
A Micromachined Resonant Micro-Pressure Sensor

Sen Zhang,Yu Zheng,Yulan Lu,Bo Xie,Deyong Chen,Junbo Wang,Jian Chen

DOI: https://doi.org/10.1109/jsen.2021.3091843

IF: 4.3

2021-09-15

IEEE Sensors Journal

Abstract:This article presents a micromachined resonant micro-pressure sensor, which consists of a SOI wafer for pressure sensing and a glass cap for vacuum packaging. More specifically, two resonators fabricated in device layer of SOI wafer were positioned around the center and border of pressure-sensitive diaphragm respectively with the purposed of transforming pressure. Simulations based on finite element analysis were applied to the design and optimization of the micro-pressure sensor where technical issues correlated with mechanical coupling and overloading were addressed properly. The micro-pressure sensors were fabricated by silicon based bulk-micromachining processes, and characterized by both open-loop and closed-loop testing. The characterization results revealed quality factors higher than 25000 in full pressure (0.05 kPa to 10 kPa) and temperature (−40°C to 85°C) scales, and at least 12 times of anti-overload capabilities for developed sensors. The differential pressure sensitivities were quantified as 615.47±9.82 Hz/kPa (−40°C), 589.56±4.34 Hz/kPa (15°C) and 561.70 ±8.75 Hz/kPa (85°C) respectively, as well the repeatability, hysteresis, and nonlinearity were calculated as 0.0485±0.0032%, 0.0299±0.0018%, and 0.0493±0.0025% respectively for the developed sensors. Meanwhile, the maximum fitting deviations were quantified within ±5.24 Pa in full pressure (0.05 kPa to 10 kPa) and temperature (−40°C to 85°C) scales, demonstrating accuracies of 0.0524% full scale, further indicating that the developed sensor is a potential candidate in the field of micro-pressure measurements.

engineering, electrical & electronic,instruments & instrumentation,physics, applied
Electrostatic-excited Silicon unitized micromechanical resonator

Zhonghe Jin,Yaolin Wan,Yigang Xu,Chun Ding,FengQiu Chen

1995-01-01

Tien Tzu Hsueh Pao/Acta Electronica Sinica

Abstract:A new structure of silicon-unitized resonator was proposed and realized, which is made by SDB technique. Electrostatic force was analyzed. The experiments show that the resonance frequency of the device is about 5.86kHz and the Q-factor is above 600 in 10Pa vacuum.
A MEMS Friction Gauge For High Vacuum Measurement

Chengxiang Wang,Huzhong Zhang,Zhanqiang Hou,Qingsong Li,Yulie Wu,Xuezhong Wu,Dingbang Xiao

DOI: https://doi.org/10.1109/ted.2023.3347382

IF: 3.1

2024-02-02

IEEE Transactions on Electron Devices

Abstract:High vacuum measurements are required in space exploration, the semiconductor industry, and other fields; however, minimized vacuum gauge for high vacuum (< 0.1 Pa) measurement remains unsettled. Herein, we present a microelectromechanical system (MEMS)-based friction vacuum gauge with a large damping area and a small air gap for gas damping ( enhancement, along with a double torsion mode to reduce thermal elastic damping losses ( and anchor losses ( . After using the damping adjustment methods, the lower limit of the gauge in the linear range ( was extended to Pa. The gauge covers a linear measurement range from to 0.1 Pa with excellent repeatability, high resolution ( Pa), and a good temperature characteristic (0.107%/°C). This gauge is anticipated to be used for leakage measurements of microvacuum chambers, as well as integrated with other miniaturized vacuum gauges to expand the measurement range of MEMS vacuum gauges.

engineering, electrical & electronic,physics, applied
A Micromachined Resonant Low-Pressure Sensor With High Quality Factor

Yu Zheng,Sen Zhang,Deyong Chen,Junbo Wang,Jian Chen

DOI: https://doi.org/10.1109/jsen.2021.3096544

IF: 4.3

2021-09-15

IEEE Sensors Journal

Abstract:This article presents a micromachined resonant low-pressure sensor with high quality factor. In this sensor, an island-diaphragm structure was developed, translating low pressures under measurements to frequency shifts of resonators, and improving quality factors of resonators by eliminating modal interferences between resonators and the pressure-sensitive diaphragm. Numerical simulations were conducted, confirming that the developed resonant low-pressure sensor can work properly in the measurement range without modal interference due to the island-diaphragm structure. The fabrication process of the developed resonant low-pressure sensor including key steps of deep reactive ion etching, resonator release and anodic bonding was conducted in this study. Experimental characterization showed high quality factors of resonators (>30000), which were significantly better than previous study (<10000). Moreover, low fitting errors (within ±2 Pa), low hysteresis (within ±2 Pa) and high accuracies (measurement errors within ±2 Pa) were also characterized in the low pressure range of 0.1 kPa-1 kPa and the temperature range of −40 °C–60 °C, validating the high performances of the developed resonant low-pressure sensor.

engineering, electrical & electronic,instruments & instrumentation,physics, applied
Silicon resonant microcantilevers for absolute pressure measurement

S. Bianco,M. Cocuzza,S. Ferrero,E. Giuri,G. Piacenza,C. F. Pirri,A. Ricci,L. Scaltrito,D. Bich,A. Merialdo,P. Schina,R. Correale

DOI: https://doi.org/10.1116/1.2214698

2006-01-01

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Abstract:This work is focused on the developing of silicon resonant microcantilevers for the measurement of the absolute pressure. The microcantilevers have been fabricated with a two-mask bulk micromachining process. The variation in resonance response of microcantilevers was investigated as a function of pressure (10−1–105Pa), both in terms of resonance frequency and quality factor. A theoretical description of the resonating microstructure is given according to different molecular and viscous regimes. Also a brief discussion on the different quality factors contributions is presented. Theoretical and experimental data show a very satisfying agreement. The microstructure behavior demonstrates a certain sensitivity over a six decade range and the potential evolution of an absolute pressure sensor working in the same range.
A resonant high-pressure microsensor based on a composite pressure-sensitive mechanism of diaphragm bending and volume compression

Pan Qian,Zongze Yu,Jie Yu,Yulan Lu,Bo Xie,Jian Chen,Deyong Chen,Junbo Wang

DOI: https://doi.org/10.1038/s41378-024-00667-8

2024-03-15

Microsystems & Nanoengineering

Abstract:Abstract In this paper, a composite pressure-sensitive mechanism combining diaphragm bending and volume compression was developed for resonant pressure microsensors to achieve high-pressure measurements with excellent accuracy. The composite mechanism was explained, and the sensor structure was designed based on theoretical analysis and finite element simulation. An all-silicon resonant high-pressure microsensor with multiple miniaturized cavities and dual resonators was developed, where dual resonators positioned in two resonant cavities with suitably different widths are used to perform opposite characteristics in pressure and the same characteristics at different temperatures, which can improve pressure sensitivities and realize temperature self-compensation by differential frequency output. The microsensor was fabricated by microfabrication, and the experimental results showed that the sensor had an accuracy of ±0.015% full scale (FS) in a pressure range of 0.1~100 MPa and a temperature range of −10~50 °C. The pressure sensitivity of the differential frequency was 261.10 Hz/MPa (~2523 ppm/MPa) at a temperature of 20 °C, and the temperature sensitivities of the dual resonators were −1.54 Hz/°C (~−14.5 ppm/°C) and −1.57 Hz/°C (~−15.6 ppm/°C) at a pressure of 2 MPa. The differential output had an outstanding stability within ±0.02 Hz under constant temperature and pressure. Thus, this research provides a convenient solution for high-pressure measurements because of its advantages, namely, large range, excellent accuracy and stability.

nanoscience & nanotechnology,instruments & instrumentation
A Resonant Low-Pressure Microsensor With Low Temperature Disturbance

Yu Zheng,Sen Zhang,Deyong Chen,Junbo Wang,Jian Chen

DOI: https://doi.org/10.1109/jsen.2022.3164801

IF: 4.3

2022-01-01

IEEE Sensors Journal

Abstract:This article introduces a resonant low-pressure microsensor comprising a silicon-on-insulator wafer (SOI) for low-pressure sensing, and a glass-on-silicon wafer (GOS) for vacuum package. In GOS wafer, the inclusion of silicon layer can dramatically decrease thermal mismatch between device layer in SOI and glass layer in GOS, effectively reducing temperature disturbance of the resonant low-pressure microsensor from 107 Hz/°C (with glass wafer packaging) to 26 Hz/°C (with GOS wafer packaging) based on FEA simulations. Experimental results demonstrated that the low-pressure sensitivities and temperature disturbances for the fabricated microsensors were measured as ±4 Hz/Pa and 35 Hz/°C separately. Based on pressure and temperature calibrations, higher accuracies indicated by fitting errors inside ±1.8 Pa, measurement errors inside ±4 Pa and hysteresis inside 1.6 Pa, were realized by the resonant low-pressure microsensor in the pressure and temperature ranges of 0.1-1 kPa and −40 – 80 °C, demonstrating higher performances than previous studies with wider temperature range.

engineering, electrical & electronic,instruments & instrumentation,physics, applied
A Composite-Type MEMS Pirani Gauge for Wide Range and High Accuracy

Shuo Chen,Liuhaodong Feng,Song Guo,Yucheng Ji,Shuwen Zeng,Xinlin Peng,Yang Xu,Tianbao Hu,Zhenyu Wu,Shinan Wang

DOI: https://doi.org/10.3390/s23031276

IF: 3.9

2023-01-23

Sensors

Abstract:To achieve a wide range and high accuracy detection of the vacuum level, for example, in an encapsulated vacuum microcavity, a composite-type MEMS Pirani gauge has been designed and fabricated. The Pirani gauge consists of two gauges of different sizes connected in series, with one gauge having a larger heat-sensitive area and a larger air gap for extending the lower measurable limit of pressure (i.e., the high vacuum end) and the other gauge having a smaller heat-sensitive area and a smaller air gap for extending the upper measurable limit. The high-resistivity titanium metal was chosen as the thermistor; SiNx was chosen as the dielectric layer, considering the factors relevant to simulation and manufacturing. By simulation using COMSOL Multiphysics and NI Multisim, a range of measurement of 2 × 10−2 to 2 × 105 Pa and a sensitivity of 52.4 mV/lgPa were obtained in an N2 environment. The performance of the fabricated Pirani gauge was evaluated by using an in-house made vacuum test system. In the test, the actual points of measurement range from 6.6 × 10−2 to 1.12×105 Pa, and the highest sensitivity is up to 457.6 mV/lgPa. The experimental results are better in the range of measurement, sensitivity, and accuracy than the simulation results. The Pirani gauge proposed in this study is simple in structure, easy to manufacture, and suitable for integration with other MEMS devices in a microcavity to monitor the vacuum level therein.

engineering, electrical & electronic,chemistry, analytical,instruments & instrumentation
Research on Micromachined Pirani Gauge

ZHOU Ji-long,CHEN Ken-le,ZHANG Jin-wen,JIN Yu-feng

DOI: https://doi.org/10.3969/j.issn.1004-1699.2008.03.038

2008-01-01

Abstract:This paper reports a novel microelectromechanical systems(MEMS)device—Micromechined Pirani Gauge—which is used to monitor pressure changes in vacuum package.This Pirani Gauge utilizes heat conduct in a small gap between the silicon heater and heat sinks to monitor pressure.A lateral micromachined Pirani Gauge with a simplified structure was designed and prepared using dissolved wafer process and bonding technology.The experiment results show our lateral micromachined Pirani Gauge has a very good linearity of thermal impedance versus pressure in the range of 10 Pa ~ 300 Pa.
A Simple Micro Pirani Vasuum Gauge Fabricated by Bulk Micromachining Technology

Jinwen Zhang,Wei Jiang,Jilong Zhou,Xin Wang

DOI: https://doi.org/10.1109/sensor.2009.5285508

2009-01-01

Abstract:In this paper, a very simple micro vacuum pirani gauge made of single crystal silicon is presented. It was fabricated by standard bulk micromachining with only three masks. The high aspect ratio structure of the pirani gauge has large efficient gaseous heat transfer area, thus can increase the sensitivity of the pirani gauge. The dynamic range of the pirani gauge is 2 Pa to 400 Pa which should be larger if the power of the current source be larger with high sensitivity. And the average sensitivity is 184 K/W/Pa.
A high performance micro-pressure sensor based on a double-ended quartz tuning fork and silicon diaphragm in atmospheric packaging

Rongjun Cheng,Cun Li,Yulong Zhao,Bo Li,Bian Tian

DOI: https://doi.org/10.1088/0957-0233/26/6/065101

IF: 2.398

2015-04-30

Measurement Science and Technology

Abstract:A resonant micro-pressure sensor based on a double-ended quartz tuning fork (DEQTF) and bossed silicon diaphragm in atmospheric packaging is presented. To achieve vacuum-free packaging with a high quality factor, the DEQTF is designed to resonate in an anti-phase vibration mode in a plane that is under the effect of slide-film damping. The feasibility is demonstrated by theoretical analysis and a finite element simulation. The dimensions of the DEQTF and diaphragm are optimized in accordance with the principles of improving sensitivity and minimizing energy dissipation. The sensor chip is fabricated using quartz and silicon micromachining technologies, and simply packaged in a stainless steel shell with standard atmosphere. The experimental setup is established for the calibration, where an additional sensor prototype without a pressure port is introduced as a frequency reference. By detecting the frequency difference of the tested sensor and reference sensor, the influences of environmental factors such as temperature and shocks on measuring accuracy are eliminated effectively. Under the action of a self-excitation circuit, static performance is obtained. The sensitivity of the sensor is 299?kHz?kPa?1 in the operating range of 0?10?kPa at room temperature. Testing results shows a nonlinearity of 0.0278%FS, a hysteresis of 0.0207%FS and a repeatability of 0.0375%FS. The results indicate that the proposed sensor has favorable features, which provides a cost-effective and high-performance approach for low pressure measurement.

engineering, multidisciplinary,instruments & instrumentation
Miniature capacitance diaphragm gauge for absolute vacuum measurement

Xiaodong Han,Gang Li,Mahui Xu,Chaomao Guo,Yongjun Wang,Yongjian Feng,Detian Li

DOI: https://doi.org/10.1016/j.measurement.2022.110851

IF: 5.6

2022-02-01

Measurement

Abstract:Miniaturization of sensors using micromachining technology is full of potential and challenges. A miniature capacitance diaphragm gauge for absolute vacuum measurement is developed in this work. Both theoretical calculation and simulation method are used to analyze the working principle of the pressure sensitive diaphragm in different pressure regions. During the manufacturing processes, a silicon block coated with non-evaporable getter films is used to protect the diaphragm and maintain the vacuum pressure of the reference cavity. The capacitance diaphragm gauge with an overall size of 8 × 10 × 1.4 mm3 was successfully fabricated, and its vacuum metrologies in rough and medium vacuum regime were evaluated systematically. The lower measurement limit of the gauge is 0.1 Pa, its maximum and minimum sensitivities in the range of 0.1 Pa to 84 kPa are 10.96 and 0.16 fF/Pa, respectively. The repeatability and the hysteresis errors of the gauge are less than 1.3% and 5.3%.

engineering, multidisciplinary,instruments & instrumentation
A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging

Bo Xie,Yonghao Xing,Yanshuang Wang,Jian Chen,Deyong Chen,Junbo Wang

DOI: https://doi.org/10.3390/s150924257

2015-09-21

Abstract:This paper presents the fabrication and characterization of a resonant pressure microsensor based on SOI-glass wafer-level vacuum packaging. The SOI-based pressure microsensor consists of a pressure-sensitive diaphragm at the handle layer and two lateral resonators (electrostatic excitation and capacitive detection) on the device layer as a differential setup. The resonators were vacuum packaged with a glass cap using anodic bonding and the wire interconnection was realized using a mask-free electrochemical etching approach by selectively patterning an Au film on highly topographic surfaces. The fabricated resonant pressure microsensor with dual resonators was characterized in a systematic manner, producing a quality factor higher than 10,000 (~6 months), a sensitivity of about 166 Hz/kPa and a reduced nonlinear error of 0.033% F.S. Based on the differential output, the sensitivity was increased to two times and the temperature-caused frequency drift was decreased to 25%.
Modelling and Characterisation of a Micromachined Resonant Pressure Sensor with Piezoelectric Excitation and Sensing

Rongjun Cheng,Yulong Zhao,Cun Li,Bo Li,Qi Zhang

DOI: https://doi.org/10.1049/mnl.2016.0016

2016-01-01

Abstract:A resonant pressure sensor with piezoelectric excitation and sensing is presented, which is realised by combining a micromachined diaphragm and a quartz resonator. The sensor performance is improved by introducing double enhancement beams into the diaphragm. Finite element method is utilised to reveal the validity and optimise the structural dimensions. A self-excitation circuit is designed to drive the resonator into steady oscillation. The sensor chip is fabricated by bulk micromachining technologies and packaged in a metal shell in the inert gas environment for characterisation. The performance characteristics including the short-term drift, temperature characteristic and quality factor are investigated. The experimental results demonstrate that the sensor features a high sensitivity of 100.45 Hz/kPa and a short-term drift <14 ppm in the operating range of −10∼10 kPa at room temperature. Owing to the excellent performance in sensitivity and accuracy, the sensor can be applied for micropressure measurement.
An Electrostatic Comb Excitation Resonant Pressure Sensor for High Pressure Applications

Jie Yu,Yulan Lu,Bo Xie,Qinggang Meng,Zongze Yu,Jiaxin Qin,Jian Chen,Junbo Wang,Deyong Chen

DOI: https://doi.org/10.1109/jsen.2022.3183298

IF: 4.3

2022-08-15

IEEE Sensors Journal

Abstract:In order to meet growing attentions and demands in the high-accuracy and high-pressure applications of deep-sea sciences, petroleum exploration, special industrial manufacturing, a silicon resonant high-pressure sensor with the measurement range of 50 MPa was developed based on double resonators of dual electrostatic comb excitation and piezoresistive detection in this paper. When operating, the frequency shifts of the resonators suspended in a sensitive diaphragm were produced due to the deformation of the diaphragm by applied pressure. The sensor structures were investigated by adopting the finite element analysis to extend the pressure-sensitive range with focusing on sensitivities, strength and the amplitude of the output signal and were fabricated by bulk-micromachining processes. Besides, by adopting dual synthetic comb-driven-force in the resonator, the direct current biased voltage and the negative stiffness effect of the sensor were decreased. The developed sensor here exhibited a high Q-factor value of ~46000, a differential pressure sensitivity of ~66 Hz/MPa (~930 ppm/MPa) with a linear coefficient of 0.99999, a low differential temperature sensitivity of ~0.1 Hz/°C (~1.4 ppm/°C). Benefiting from aforementioned characteristics, fitting errors of the sensor were better than 0.01% full scale (gas pressure of 0.11 to 7 MPa) under temperature range (−30 to 80°C) by using a polynomial algorithm and measurement errors of the sensor were better than 0.018% full scale (gas pressure of 0.11 to 7 MPa) under temperature range (−10 to 80°C).

engineering, electrical & electronic,instruments & instrumentation,physics, applied
Study on Micropressure Sensors of Cantilever Beam Circular Resonant Cavity

苏莹,闫树斌,张志东,汤跃,王瑞兵,陈慧斌

DOI: https://doi.org/10.3969/j.issn.1002-1841.2017.03.003

2017-01-01

Abstract:In view of traditional micro pressure sensor has low sensitivity and big volume,a new type sensor of the ring resonator integrated on cantilever was presented.Firstly the working principle of micro pressure sensor of cantilever beam circular resonant cavity was theoretically analyzed.Meanwhile,the mechanical property of cantilever was simulated and the structural parameters of cantilever and micro-ring resonator were set up,finally the ring resonator and cantilever were manufactured on SOI using MEMS technology.The coupling testing system was built to test the transmission properties of the ring resonator.The experiment shows that the Q value of the ring resonator is 7.75×104 and the sensitivity of the sensor is 31 pm/kPa.The result can meet the requirement of micro-pressure sensor with high sensitivity.
Fabrication and wafer-level vacuum packaging of MEMS resonant pressure sensor

王军波 Wang Jun-bo,曹明威 Cao Ming-wei,张. Z. Jian,焦海龙 Jiao Hai-long,陈德勇 Chen De-yong

DOI: https://doi.org/10.3788/OPE.20142205.1235

Abstract:To improve the quality factor of sensors and to protect resonators,the fabrication and waferlevel vacuum packaging methods for a Micro-electro-mechanic System(MEMS)resonant pressure sensor was proposed based on Silicon On Insulator(SOI)-glass anodic bonding technology.Through Deep Reactive Ion Etching(DRIE)process and buffered oxide etched releasing process,H-type resonant beams and pressure diaphragm of the sensor were fabricated on the low resistivity device layer and the substrate layer of SOI wafer,respectively,and a moveable mechanism was release by a SiO2 layer of the SOI wafer corroded by hydrofluoric acid flow.Finally,electrical connection and a cavity for the vibration of beams was implemented on the Pyrex glass piece by fine mechanical machining and the wafer-level vacuum packaging and electric connection of the resonators were achieved with SOIglass anodic bonding.Experimental results demonstrate that the packaging scheme is effective andeasy to achieve with an excellent hermetic sealing,and the sensor has a differential sensitivity of 10.66 Hz/hPa and linear correlation coefficient of 0.999 995in the range of 10kPa to 110kPa.

Engineering,Materials Science,Physics
Study on piezoresistor used as low vacuum gage

Xingyu Zhao,Xun Wang,Ziguang Shi

1997-01-01

Abstract:The DL-4 vacuum gage consisting of piezoresistor and control unit was developed, which worked in the range of 102-105 Pa. The operating principle, characteristics and structure of the gage were described. The piezoresistor used in low vacuum measurement was studied also. The gage has the advantages of simple structure, high accuracy, good linearity, stable performance and low cost.

New silicon micromechanical resonant viscosity vacuum gage

Thermally Excited Micromechanical Vacuum Resonator

Discussion on the optical-coupling in silicon optical-type micromechanical sensors

A Micromachined Resonant Micro-Pressure Sensor

Electrostatic-excited Silicon unitized micromechanical resonator

A MEMS Friction Gauge For High Vacuum Measurement

A Micromachined Resonant Low-Pressure Sensor With High Quality Factor

Silicon resonant microcantilevers for absolute pressure measurement

A resonant high-pressure microsensor based on a composite pressure-sensitive mechanism of diaphragm bending and volume compression

A Resonant Low-Pressure Microsensor With Low Temperature Disturbance

A Composite-Type MEMS Pirani Gauge for Wide Range and High Accuracy

Research on Micromachined Pirani Gauge

A Simple Micro Pirani Vasuum Gauge Fabricated by Bulk Micromachining Technology

A high performance micro-pressure sensor based on a double-ended quartz tuning fork and silicon diaphragm in atmospheric packaging

Miniature capacitance diaphragm gauge for absolute vacuum measurement

A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging

Modelling and Characterisation of a Micromachined Resonant Pressure Sensor with Piezoelectric Excitation and Sensing

An Electrostatic Comb Excitation Resonant Pressure Sensor for High Pressure Applications

Study on Micropressure Sensors of Cantilever Beam Circular Resonant Cavity

Fabrication and wafer-level vacuum packaging of MEMS resonant pressure sensor

Study on piezoresistor used as low vacuum gage