Abstract:A new magnetron sputtering apparatus with two annular magnets facing each other was developed and introduced here, by using which, two troubles (the limited deposition rate and limited lifetime of target) met in using the conventional planar magnetrons for sputtering were greatly improved. The experimental results on it show that (1) the deposition rate of Cu-films reaches about 800 nm/min at the sputtering power density of 11W/cm 2, and can further reach a higher value with larger input power; (2) the target utilization rate can be improved to about 64%. Furthermore, the angular distribution of sputtered particles was studied under the assumption of cos n��-distribution, and it was found that if we set n=3.3, good coincidence between the calculative and experimental results can be obtained.

Development of high-efficiency planar magnetron sputtering gun