Characterization of Ti-Al-N Films Deposited by Cathodic Vacuum Arc with Different N2 Partial Pressure
G. P. Zhang,X. Q. Wang,G. H. Lv,H. Chen,H. Pang,L. Zhou,J. Huang,W. Chen,S. Z. Yang
DOI: https://doi.org/10.4028/www.scientific.net/amr.287-290.2429
2011-01-01
Advanced Materials Research
Abstract:A series of Ti-Al-N films were deposited on silicon wafer and steel substrates by cathodic vacuum arc technique in N2/Ar gas mixtures, using a compound Ti(50):Al(50) target. The chemical composition, crystalline microstructure, film deposition rate and surface morphology of the films were investigated by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscope (SEM) coupled with an energy dispersive X-ray analysis system (EDX), respectively. The hardness and Young’s modulus, wear performance and corrosion behavior of the Ti-Al-N (multi-phase) films at different N2 partial pressure were analyzed and explained on the basis of microstructure, mechanical properties and wear mechanisms.