Photoacoustic Laminated Characterization of Dynamic Integrated-Circuits

JW FANG,SY ZHANG,JC CHENG
DOI: https://doi.org/10.1051/jp4:1994748
1994-01-01
Abstract:The layered photoacoustic imaging of dynamic integrated circuits(IC) devices is studied experimentally and theoretically. The experimental method can be used not only to investigate the surface and subsurface structures, but also to analyze the operation modes of the electronic components and the operation principles of IC devices.
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