Thermal characterization of a bridge-link carbon nanotubes array used as a thermal adhesive

Hao Rong,Weiqing Lin,Jincheng Zheng,Miao Lu
DOI: https://doi.org/10.1016/j.ijadhadh.2013.12.006
IF: 3.848
2014-01-01
International Journal of Adhesion and Adhesives
Abstract:A dense and vertically aligned single-walled carbon nanotube (SWCNT) array was assembled between a chip and a substrate by a fluidic assembly method. The SWCNT bridged the interface as a thermal interface material (TIM). The minimum interfacial thermal resistance was measured close to 4.5mm2K/W by the laser flash method. This value was lower than that of commercial thermal grease. Filling up the remaining space of the SWCNT array with a highly penetrative glue (LOCTITE®4699™, Henkel Co. Korea) was found to produce a significant increase in shear strength from 450kPa to 3MPa, as well as an approximate 10% decrease in thermal diffusivity. The material's higher thermal performance is expected to allow a chip to make a good connection to a heat sink in microelectronics packaging, thus acting as a substitute for conventional thermal adhesives.
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