Aligned Silicon Nanowires with Fine‐tunable Tilting Angles by Metal‐assisted Chemical Etching on Off‐cut Wafers

Jie Ma,Liping Wen,Zhichao Dong,Tong Zhang,Shutao Wang,Lei Jiang
DOI: https://doi.org/10.1002/pssr.201307190
2013-01-01
Abstract:The morphology control of aligned silicon nanowires (SiNWs) is highly desirable as SiNWs demonstrated high prospect in a variety of applications. Besides the control over length, shape and distribution of aligned SiNWs, the fine‐tuning of tilting angles thereof also attracted intense interest. Up to now, only several discrete tilting angles have been reported. In this Letter, the ability to fine‐tune the tilting angle of SiNWs is demonstrated and the range that can be achieved is identified. Our technique employs the anisotropic characteristic of the etching process using custom‐produced off‐cut Si wafers of various orientations as substrates. With this technique, a uniquely favoured etching direction can result and the tilting angle can be precisely controlled. Tilted SiNWs with tilting angles from 0° to 50° relative to the wafer normal were obtained. The mechanism of the tilting angle manipulation is also discussed. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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