Abstract:This paper presents an efficient design approach for microelectromechanical systems (MEMS) gyroscope considering the design constraint of MEMSCAP's Silicon-on-Insulator Multi-User MEMS Processes (SOIMUMPs). A design for a decoupled mass MEMS resonant gyroscope with tuning electrodes is presented to minimize cross-axis coupling and optimize the gyroscope's performance. The device features a size of 1.8 ×2.772 mm^2. A decoupled mass MEMS gyroscope has been designed using a novel mechanical beam configuration that optimizes the structural design to reduce unwanted interactions between drive and sense axes motions. Mode order has been achieved by obtaining the first two modes as drive and sense modes at 9946.3 Hz and 10202.7 Hz, respectively. Parallel plate electrostatic tuning electrodes have been added to adjust and match the drive and sense modes at the resonant frequencies of 9946 Hz. This mode matching is crucial for optimizing gyroscope performance, accuracy, and sensitivity. The effects of temperature variation on the performance of the designed decoupled mass MEMS gyroscope have been investigated, particularly in terms of its mode-matched operation achieved using tuning electrodes. Finite Element Method (FEM) simulations were conducted, demonstrating that thermal stability was achieved, and mode-matched operation was maintained within the temperature range of -40 oC to 80 oC. The gyroscope exhibits enhanced performance compared to existing MEMS gyroscopes under mode-matched conditions, featuring a lower temperature coefficient of frequency (TCF) at 0.0415 Hz/oC in the drive mode and 0.0165 Hz/oC in the sense mode. FEM analysis for the fabrication process tolerances has been done, where MEMS gyroscope's resonant frequencies, output capacitance, output displacement, and sense mode quality factor have shown negligible changes to fabrication process tolerances. Transient analysis was conducted using CoventorWare MEMS+ 3D schematic, which was integrated with MATLAB Simulink to measure the MEMS gyroscope's output response, which corresponded with the varying input angular velocity signal.

Investigation Of A Vacuum Packaged Mems Gyroscope Architecture'S Temperature Robustness

Temperature Model for a Vacuum Packaged MEMS Gyroscope Structure

Effects of Structural Dimension Variation on the Vibration of MEMS Ring-Based Gyroscopes

Thermal stress of MOEMS Accelerometers Based on Grating Interferometric cavity

Temperature-dependence improvement for a MEMS gyroscope using triangular-electrode based capacitive detection method

A 0.09°/h Bias-Instability MEMS Gyroscope Working with a Fixed Resonance Frequency

Research on the Packaging Reliability and Degradation Models of Quality Factors for a High Vacuum Sealed MEMS Gyroscope

Modeling and analysis of frequency shift of MEMS gyroscope subjected to temperature change

Thermal Stabilization of Quality Factor for Dual-Axis MEMS Gyroscope Based on Joule Effect in Situ Dynamic Tuning

Modeling and Analysis of Temperature Effect on MEMS Gyroscope

A novel robust design method for the sense mode of a MEMS vibratory gyroscope based on fuzzy reliability and Taguchi design

Design and optimization of a resonant output frequency gyroscope for robust sensitivity and bandwidth performance

Design and Analysis of Mode-Matched Decoupled Mass MEMS Gyroscope with Improved Thermal Stability

Microfabrication Process-Driven Design, FEM Analysis and System Modeling of 3-DoF Drive Mode and 2-DoF Sense Mode Thermally Stable Non-Resonant MEMS Gyroscope

Design of on-chip temperature-controlling system for MEMS vibratory gyroscope

Gas Damping Coefficient Research for MEMS Comb Linear Vibration Gyroscope

Structure-air Damping Coupling Analysis of Micromachined Gyroscope

Research of High Temperature Aging Failure Mechanism about Vacuum Packaging MEMS Gyroscope

Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes

Optimization of Sensitivity for a Novelly-Designed MEMS Resonant Gyroscope

Modeling and Reliability Analysis of MEMS Gyroscope Rotor Parameters under Vibrational Stress