Abstract:This paper presents microfabrication process-driven design of a multi-degree of freedom (multi-DoF) non-resonant electrostatic microelectromechanical systems (MEMS) gyroscope by considering the design constraints of commercially available low-cost and widely-used silicon-on-insulator multi-user MEMS processes (SOIMUMPs), with silicon as a structural material. The proposed design consists of a 3-DoF drive mode oscillator with the concept of addition of a collider mass which transmits energy from the drive mass to the passive sense mass. In the sense direction, 2-DoF sense mode oscillator is used to achieve dynamically-amplified displacement in the sense mass. A detailed analytical model for the dynamic response of MEMS gyroscope is presented and performance characteristics are validated through finite element method (FEM)-based simulations. The effect of operating air pressure and temperature variations on the air damping and resulting dynamic response is analyzed. The thermal stability of the design and corresponding effect on the mechanical and capacitive sensitivity, for an operating temperature range of −40 °C to 100 °C, is presented. The results showed that the proposed design is thermally stable, robust to environmental variations, and process tolerances with a wide operational bandwidth and high sensitivity. Moreover, a system-level model of the proposed gyroscope and its integration with the sensor electronics is presented to estimate the voltage sensitivity under the constraints of the readout electronic circuit.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to design a multi - degree - of - freedom (multi - DoF), non - resonant micro - electro - mechanical system (MEMS) gyroscope in order to achieve a wide operating bandwidth and high mechanical sensitivity, while ensuring its thermal stability under different environmental conditions. Specifically, the paper focuses on the following aspects: 1. **Design Optimization**: The paper proposes a design method driven by micro - fabrication processes, aiming to consider the design constraints of commercially available, low - cost, and widely - used silicon - based multi - user MEMS processes (SOIMUMPs). Using silicon as the structural material, a non - resonant MEMS gyroscope with a 3 - degree - of - freedom (3 - DoF) drive - mode oscillator and a 2 - degree - of - freedom (2 - DoF) sensing - mode oscillator is designed. 2. **Dynamic Response Modeling**: A detailed dynamic response analysis model is proposed and the performance characteristics are verified by finite element method (FEM) simulation. 3. **Environmental Impact Analysis**: The effects of operating air pressure and temperature changes on air damping and dynamic response are analyzed, with particular attention paid to the thermal stability designed within the operating temperature range from - 40°C to 100°C and the corresponding changes in mechanical and capacitive sensitivity. 4. **System - Level Modeling**: An integrated model of the designed gyroscope and the sensor electronic system is proposed to estimate the voltage sensitivity under the constraints of the read - out electronic circuit. ### Main Challenges - **Increasing Mechanical Sensitivity and Operating Bandwidth**: In the design, a 3 - DoF drive - mode and a 2 - DoF sensing - mode oscillator are adopted. By increasing the collider mass to transfer energy, higher dynamic amplification is achieved. - **Thermal Stability**: By selecting silicon material with better thermal stability and optimizing the structural design to reduce the impact of environmental changes, the gyroscope is ensured to maintain stable performance over a wide temperature range. - **Micro - fabrication Process Limitations**: During the design process, the limitations of the SOIMUMPs micro - fabrication process need to be considered, such as the inability to survive the central anchor point, the inability to fabricate the bottom electrode, and the limitation of the etching area. ### Design Features - **3 - DoF Drive Mode**: It includes an outer mass block \(m_1\), a collider mass block \(m_2\) and a final vibration absorber \(m_3\) (composed of \(m_{3a}\) and \(m_{3b}\)). - **2 - DoF Sensing Mode**: It includes two mass blocks \(m_{3a}\) and \(m_{3b}\), which are connected by mechanical springs \(k_{y1}\) and \(k_{y2}\), where \(m_{3b}\) serves as a dynamic vibration absorber for \(m_{3a}\). - **Capacitive Displacement Detection**: The displacement of \(m_{3b}\) is detected using parallel - plate capacitance, and the noise impact is reduced through a differential configuration (gap - antigap). ### Dynamic Equations For the input driving force \(F\cos(\omega t)\), the displacements of the mass blocks \(m_1\), \(m_2\) and \(m_3\) in the drive mode are represented as \(x_1\), \(x_2\) and \(x_3\) respectively. The dynamic equations are as follows: \[ m_1\ddot{x}_1 + c_{1x}\dot{x}_1 + k_1x_1 + k_{12}(x_1 - x_2)=F_D \] \[ m_2\ddot{x}_2 + k_2x_2 + k_{12}(x_2 - x_1)+ k_{23}(x_2 - x_3)=0 \] \[ (m_f + m_{3a}+ m_{3b})\ddot{x}_3 + c_{2x}\dot{x}_3 + k_3x_3 + k_{23}(x_3 - x_2)=0 \] For the angular rate \(\Omega\) on the \(z\) - axis, the dynamic equations of the sensing mode are as follows: \[ m_{3a}\ddot{y}_1 + k_{y1}y_1 + k_{y2}(y_1 - y_2)=F_C(m

Microfabrication Process-Driven Design, FEM Analysis and System Modeling of 3-DoF Drive Mode and 2-DoF Sense Mode Thermally Stable Non-Resonant MEMS Gyroscope

Design and Analysis of Mode-Matched Decoupled Mass MEMS Gyroscope with Improved Thermal Stability

A Bulk Micromachined Gyroscope With Improved Quality-Factors At Atmospheric Pressure

A MICROMECHANICAL MODE-MATCHED GYROSCOPE USING STIFFNESS NONLINEARITY AND ELECTROSTATIC TUNING

An Electrostatically-driven Capacitively-sensed Frame Microgyroscope Fabricated with an Improved Process Flow

A Digital Control Structure for Lissajous Frequency-Modulated Mode MEMS Gyroscope

A Systematic Design Optimization Approach for Multiphysics MEMS Devices Based on Combined Computer Experiments and Gaussian Process Modelling

Bandwidth optimization design of a multi degree of freedom MEMS gyroscope

Design and Modelling of MEMS Vibrating Internal Ring Gyroscopes for Harsh Environments

Design of a Tri-Axial Surface Micromachined MEMS Vibrating Gyroscope

A Vertically Supported Ring-Type MEMS Gyroscope Utilizing Electromagnetic Actuation and Sensing

Design and optimization of a resonant output frequency gyroscope for robust sensitivity and bandwidth performance

Design of a Micro-Electro Mechanical System Quad Mass Gyroscope with Compliant Mechanical Amplification

Design and dynamic analysis of a highly sensitive MEMS gyroscope based on mode localization.

System Modeling of a MEMS Vibratory Gyroscope and Integration to Circuit Simulation

A Novel Microelectromechanical Resonant Gyroscope

Design And Simulation Of A Completely Decoupled Micromechanical Gyroscope

Electromechanical Analysis of Microelectromechanical Structures and Dynamic Simulations of Laterally Vibratory Microgyroscope

Design of an interface circuit system for mode-separation MEMS digital gyroscope

Development and Research of the Sensitive Element of the MEMS Gyroscope Manufactured Using SOI Technology

Optimization of Sensitivity for a Novelly-Designed MEMS Resonant Gyroscope