Irradiated Damages of Femtosecond Laser in Two Different Monocrystalline Silicon Wafers

MA Peng-fei,LIU Zhong-shan,CHANG Fang-gao,SONG Gui-lin,WANG Ke-dong
DOI: https://doi.org/10.16553/j.cnki.issn1000-985x.2013.01.017
2013-01-01
Abstract:Two different monocrystalline silicon wafers were irradiated by femtosecond laser in the same energy densities to study the roles of the impurities inside during processes when the ultrashort pulse laser irradiated to the materials.A series of parallel etched grooves in the silicon's surfaces were formed,and the bottoms of the etched grooves densely packed by micro/nano-particles.The morphologies of the two samples were different which were observed by means of scanning electron microscope and surface profiler,and which indicated that the irradiated damages were different in the two silicon wafers.This result showed that the irradiation damages of the materials were determined by the inherent impurity defects to some extent,the impurities within materials could aggravate the irradiation damages.
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