Abstract:Thermally conductive adhesives (TCAs) have been widely used in electronic packaging industry, such as for chip packages in smart phones and high-power LED lightings, as they combine the workability of polymer resins with the high thermal conductivity of fillers([1-4]). The polymer resins endow adequate adhesion strength and provide sufficient mechanical robustness. The thermally conductive fillers mainly determine the capacity of heat dissipation; and the filler can be carbon nanotube, graphene, aluminum nitride, and metal, etc. Among the metallic filler materials, silver is regarded as a competitive TCA filler because of the superior thermal conductivity (similar to 400 W.m(-1).k(-1)) and resistance to oxidization. The interfacial resistance can be dramatically reduced when sintering behavior is occurred. Yet, it is still a great challenge to fabricate silver-based TCA samples at low temperature with a relatively high thermal conductivity since it is hard to sinter at a moderate temperature. In this work, a simple surface treatment of silver micro-flakes is applied. Laser flash apparatus results show that the out-of-plane thermal conductivity of 85 wt% TCAs achieve 22 W.m(-1).k(-1)when cured at 190 degrees C. The out-of-plane thermal conductivity of the TCA sample is ideal for applications in high-power thermal interface materials. It is notable that the surface treatment only simply includes two steps: hydrazine hydrate treatment and iodination treatment. A careful study on the influence factors such as surface treatment, curing temperature was conducted. The excellent heat conducting behavior renders the TCA with a good deal of future applications in high-power electron packaging.

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Thermal improvement of die attach by using PDMS-grafted particles as filler and Its application in solid state lighting

Improvement of the Thermal Conductivity by Surface Iodination

Surface Iodination: A Simple and Efficient Protocol to Improve the Isotropically Thermal Conductivity of Silver-Epoxy Pastes

Investigation of Electrical and Thermal Behavior of Modified Epoxy Structures for DC and High Frequency Applications

Highly Conductive Die Attach Adhesive from Percolation Control and Its Applications in Light-Emitting Device Thermal Management

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

Thermal Management for Microscale Inorganic Light-Emitting Diodes

Improved Thermal Performance of High-Power Led by Using Low-Temperature Sintered Chip Attachment

Effect of in-line electron beam treatment on the electrical performance of Cu/organic low-k damascene interconnects

Expanding the Hole Delocalization Range in Excited Molecules for Stable Organic Light-Emitting Diodes Employing Thermally Activated Delayed Fluorescence

Room-Temperature Curing and Grain Growth at High Humidity in Conductive Adhesives with Ultra-Low Silver Content

Improving the Stability of Green Thermally Activated Delayed Fluorescence OLEDs by Reducing the Excited-State Dipole Moment

In Situ Generation of Photosensitive Silver Halide for Improving the Conductivity of Electrically Conductive Adhesives.

Silver Pastes With Excellent Thermal Conductivity

Recent Advances on Thermal Management of Flexible Inorganic Electronics

A novel thermal conductive Ag2O paste for thermal management of light-emitting diode

Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LED

Conductivity Enhancement of Polymer Composites Using High-Temperature Short-Time Treated Silver Fillers

Thermally Stable Inverted Organic Light-Emitting Diodes Using Ag-doped 4,7-Diphenyl-1,10-phenanthroline As an Electron Injection Layer