Structure and wettability control of Cu-Ni-P alloy synthesized by electroless deposition

Wenjing Zhang,Haiyong Cao,Xue Feng,Anmin Hu,Ming Li
DOI: https://doi.org/10.1016/j.jallcom.2012.05.108
IF: 6.2
2012-01-01
Journal of Alloys and Compounds
Abstract:Cu-Ni-P alloy with unique microstructures were deposited by electroless plating. The effect of deposition parameters on the morphology, crystallographic texture and hydrophobic property of the as-prepared alloy was investigated. SEM observation reveals that the morphology of Cu-Ni-P deposits can be controlled by adjusting Ni 2+ concentration, temperature and pH value. Cone structure with dimensions of about 5 μm in height and 0.5 μm in root diameter could be obtained by optimum parameters of 0.0024 M Ni 2+, 70 °C, pH 9, 0.05 M sodium citrate and 50 ppm PEG10000 (or 4000). XRD results show that Cu-Ni-P cone structure is well-crystallized and exhibits strong (1 1 1) texture. When the concentration of Ni 2+ and OH - increases, the surface of Cu-Ni-P coating is comparatively smooth and shows a preferred orientation of (2 2 0). Static contact angles were measured to investigate the surface's wettability. The results reveal that Cu-Ni-P alloy with dense cone structure is hydrophobic with maximum static contact angle of 140°, while that of flat Cu-Ni-P alloy is 93°. © 2012 Elsevier B.V. All rights reserved.
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