Skew Ion-Bombardment-Induced Microstructure and Magnetic Anisotropy Evolutions in the Immiscible Co-Cu System during Deposition Process

Fei Zeng,Yang Gao,Yuwei Fan,Feng Pan
DOI: https://doi.org/10.1143/JJAP.42.6869
2003-01-01
Abstract:Co-Cu alloy films with a metastable fcc structure were prepared using the ion beam assisted deposition (IBAD) technique at various ion incidence angles. The films prepared at the ion incidence angles of 15degrees to 60degrees showed the {220} out-of-plane texture and in-plane magnetic anisotropy. The fcc phase and hcp phase were obtained in the samples prepared at 75degrees and glancing incidence angle. It was regarded that the microstructure and magnetic anisotropy evolutions with variations of the ion incidence angle result from three main effects induced by ion interaction, i.e., ion mixing effect, channeling effect and enhancing effect of atomic migration in the ion incidence plane.
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