Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

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Eff ects of Diff erent Mechanical Alloying Parameters on Microstructure of High Temperature Nanocrystalline Cu-Ta Alloys

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Anomalous Plastic Deformation in Nanoscale Cu/Ta Multilayers

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Effects of Mass Density on the Microhardness and Modulus of Tetrahedral Amorphous Carbon Films

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Influence Of Interfacial Texture On Solid-State Amorphization And Associated Asymmetric Growth In Immiscible Cu-Ta Multilayers

Effects of Cu Layers on the Deformation Behavior of CuTa/Cu Multilayer Thin Films

Atomic assembly of Cu/Ta multilayers: Surface roughness, grain structure, misfit dislocations, and amorphization

Amorphous Alloy Formation in Immiscible Cu-Ta and Cu-W Systems by Atomistic Modeling and Ion-Beam Mixing

Unique Mechanical Properties of Cu/(NbMoTaW) Nanolaminates

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Thickness and Grain Size Dependent Mechanical Properties of Cu Films Studied by Nanoindentation Tests

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Effect of Ta on the microstructure and mechanical properties of W Ta alloys prepared by arc melting