Abstract:With the methods of single-specimen and multiple-specimen, the subsequent yield surfaces of the copper underwent tension, torsion and combined tension torsion pre-deformation respectively are studied by crystal plasticity simulation comparing with the real test employing thin-walled tubular specimens. Not the variances of measured subse-quent yield surface but also the phenomena of subsequent yield surface appearing concave are discussed under considering different conditions, including different pre-deformation, the number of probing point, the test sequence of the probing points, and the specified offset strain, etc. On this basis, the rationality and validity of the two methods for subsequent yield testing are compared. The simulations probing yield surface are conducted using the FE model of thin-walled tubu-lar specimen, in which the crystal lattice orientation for each element is arranged randomly, associated with a modified crystal plasticity constitutive model that is able to reflecting the Bauschinger effect for material under reversed loading, so that the deformation characteristic of polycrystal can be exhibited. The loading procedure of modeling test is designed as same as the real test. The investigated results show that: (1) the proposed simulation method can reproduce the real test procedure, the simulated subsequent yield phenomena are found fairly consistent with that observed in actual experimen-tal measurements, which confirmed the rationality and validity of the method; (2) both the simulated and real tests show that the subsequent yield surface measured by using the thin-walled tube under combination of tension-torsion load may be concave, and the result tested by the single specimen method is more obvious in yield surface concave no matter for simulated or real test; (3) if the test material is fairly consistent in quality, the multiple-specimen method should be more reasonable than the single-specimen method for subsequent yield surface test.

ANALYSIS OF SLIP-BAND TRACE ON SPECIMEN SURFACE OF SINGLE CRYSTAL COPPER UNDER TENSION

Analysis of Slip-Band on Specimen Surface of Polycrystalline Copper under Tension

Study of Slip-band of Crystalline Grains on the Surface of Polycrystalline Tensile Specimen

On the Tension Necking of Copper Single Crystal Specimen under Slip Deformation Mechanism

MEASURING SUBSEQUENT YIELD SURFACE OF PURE COPPER BY CRYSTAL PLASTICITY SIMULATION

CRYSTAL PLASTICITY NUMERICAL ANALYSIS ON YIELD AND SUBSEQUENT YIELD OF POLYCRYS-TALLINE COPPER UNDER COMBINED TENSION--TORSION LOADING

The Study of Tension/Compression Asymmetry of [111] Oriented Nickel Base Single Crystal Superalloys

The Meso-inhomogeneous Deformation of Pure Copper under Tension–Compression Cyclic Strain Loading

MESOMECHANICAL ANALYSIS OF THE TENSILE DEFORMATION OF PURE COPPER BICRYSTAL

Finite Element Analysis of Elastic Stress and the Resolved Shear Stress in the Primary Slip System of A Copper Tricrystal

Study of Fcc Metal Tension Behaviour by Crystal Plasticity Finite Element Method

An investigation of slip transmission during uniaxial tensile deformation of a coarse-grained copper via EBSD characterization and crystal plasticity modelling

THE THERMO-MECHANICAL COUPLED MODEL OF SINGLE CRYSTAL BASED ON RATE-DEPENDENT SLIP DEFORMATION THEORY AND ITS FEM COMPUTATION

Analysis of Stress and Deformation States in Wedge Indented Face-Centered Cubic Single Crystals

Tensile Deformation Behavior of Copper Bicrystal with Perpendicular Grain Boundary

PLASTICITY THEORY ANALYSIS OF GRAIN ORIENTATION EVOLUTION OF POLYCRYSTALLINE COPPER DURING UNIAXIAL COMPRESSION

CYCLIC DEFORMATION BEHAVIOR OF [011]MULTIPLE-SLIP-ORIENTED COPPER SINGLE CRYSTALS II. Surface Slip Features and Deformation Bands

Investigation on Plastic Flow Behaviors of FCC Polycrystalline Aluminum under Pre-Cyclic Tension-Compression Loading: Experiments and Crystal Plasticity Modeling.

A Close Observation on the Deformation Behavior of Bicrystal Copper under Tensile Loading

Crystal Plasticity Finite Element Modeling of Necking of Pure Aluminum During Uniaxial Tensile Deformation

Evolution of Persistent Slip Bands and Simulation of Its Stress Field in a Fatigued Copper Single Crystal