Finite Element Modeling of Dynamic Process of Copper Wire Ultrasonic Wedge Bonding

ZONG Fei,TIAN Yan-hong,WANG Chun-qing
DOI: https://doi.org/10.3969/j.issn.1001-3474.2007.04.001
2007-01-01
Abstract:Wire bonding is one of the most important technologies for chip interconnection in microelectronic packaging,and currently copper ultrasonic bonding attracts more attention.A finite element model of dynamic process of ultrasonic wedge bonding was established including the Cu wire,the wedge tool,the pad and the Si chip by a commercial finite element code,ANSYS software.The change of the stress field of the wedge bond at the impact stage and the ultrasonic-applied stage was simulated by the non-linear method.The stepping up of the value of plastic-deformation when ultrasonic was applied was discussed.And the change of stress and strain in the bonding structure when the ultrasonic power is changed was analyzed.
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