Research on agent-based dynamic scheduling approach forsemiconductor wafer fabrication
LI Li,QIAO Fei,XU Xiao-hong,WU Qi-di
DOI: https://doi.org/10.3969/j.issn.1006-5911.2005.12.012
2005-01-01
Computer Integrated Manufacturing Systems
Abstract:A new agent-based dynamic scheduling approach for semiconductor wafer fabrication was proposed,which integrated release control,dispatching and machine preventive maintenance scheduling.Firstly,an agent-based dynamic scheduling model was presented,which consisted of six kinds of agents,i.e.manager agent,input agent,workpiece agent,machine agent,transportation agent and operator agent.Release control was fulfilled by input agent,dispatching was performed by the negotiations between machine agents and workpiece agents and machine maintenance scheduling was implemented by the machine agents.The release control,dispatching and machine preventive maintenance scheduling were realized by agent collaboration.Secondly,the negotiation protocol among machine agents and workpiece agents,single-step negotiation protocol with time bound,was given.Thirdly,decision-making algorithms of agents were offered,including release control algorithm,dispatching algorithm and machine maintenance scheduling algorithm.Finally,the simulation results indicated that the proposed integration approach was advanced than original approaches without integration on throughput rate,cycle time, machine utility and on-time-delivery rate with better performance.