Phase and Distribution of Inclusions in Multi-crystalline Silicon Ingot for Solar Wafers

Zhou Lang
2008-01-01
Abstract:Inclusion particles severely affect surface quality of multi-crystalline silicon wafers,and threaten the wire cutting process of the wafer production from multi-crystalline silicon ingot.Because they may cause wire broken in the cutting processes.Scanning electron microscope associated with energy spectrometer for characteristic X-ray,3D digital microscope and X-ray diffraction have been used to analyze the inclusions in a directionally solidified multi-crystalline silicon ingot.The inclusions were collected by dissolving silicon samples from different positions of the silicon ingot,and extracting the un-dissolved precipitations.The results show that,there are two types of inclusions: βSiC and β-Si_3N_4,with the amount of the former relatively larger.Their morphologies are remarkably different,the SiC inclusions appear as irregularly shaped polyhedron particles,while the Si_3N_4 inclusions appear as straight rods.The inclusions are highly concentrated in the top layers of the ingot,rarely seen in 10 mm below surface.However,occasional appearance of SiC particles of larger than 100 μm in the internal part of the ingot is still found.
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