Thermal Stress Analysis of HgCdTe Focal Plane Arrays on Si Substrates

HU Xiao-ning,ZHANG Hai-yan,LI Yan-jin,HE Li
DOI: https://doi.org/10.3969/j.issn.1001-5078.2006.11.004
2006-01-01
Abstract:Infrared focal plane array(IRFPA) has a multilayer configuration which comprises of substrate,HgCdTe epilayer,Si readout IC,indium interconnects,epoxy and electrical lead board.The difference in thermal expansion between the layers has the potential to create large thermally induced stresses on the indium interconnects and the detector material.With repeated thermal cycling this can result in failure of the interconnects or lead to damage to the detector pixels.In the paper the thermal stress on HgCdTe FPA fabricated on Si substrate was analysed.The results showed that the thickness of Si substrate,the Young's modulus of epoxy and the coefficient of thermal expansion(CTE) of electrical lead board could influence the stress on HgCdTe layer,whereas the CTE of electrical lead board has the most important influence on the stress.
What problem does this paper attempt to address?