Abstract:This investigation aims at understanding the underlying fundamentals of the isothermal solidification phenomenon during the transient liquid phase (TLP) bonding process. The isothermal solidification is governed by solid-state diffusion of the melting point depressant (MPD) into the base material, which, in turn, is controlled by both kinetic and thermodynamic parameters; however, the latter factor is generally ignored. In this work, the competition between kinetics and thermodynamics of diffusion were considered in TLP bonding of a nickel alloy, Monel 400, using two distinct filler metals including pure copper (Cu) and Ni-Si-B filler metal. The joint generated by Ni-Si-B filler metal exhibited two key features including the presence of eutectic-type solidification products, an indication of incomplete isothermal solidification, and the presence of liquated grain boundaries in the substrate. However, the joint generated using pure Cu filler metal exhibited neither liquated grain boundaries nor precipitates in the diffusion-affected zone (DAZ). Interestingly, a fast isothermal solidification was observed when bonding using Cu filler metal. Despite the lower diffusivity of Cu, as a substitutional MPD in Ni-base substrate, compared to that of B, as an interstitial MPD, its higher solid solubility in the substrate provides a larger thermodynamic driving force for diffusion-induced isothermal solidification. Moreover, due to the high partitioning ratio of Cu in the Ni-base substrate and, hence, the lower difference between MPD solubility in liquid and solid phases, the required number of MPD atoms that should diffuse from the liquid phase into the base metal (BM) to complete isothermal solidification is much lower than that of B-containing filler metals. Therefore, both diffusivity and solubility of the MPD element should be considered in filler metal selection for achieving a fast isothermal solidification during TLP bonding.

Determination of Interfacial Heat Flux of Stainless Steel Solidification on Copper Substrate During the First 0.2 S

Phase Field Simulation for Non-Isothermal Solidification of Multicomponent Alloys Coupled with Thermodynamics Database

Wettability and Interfacial Heat Transfer During Solidification of Al–Si Alloy (A413) Melt Droplets on Metallic Substrates

Research methods and influencing factors of interfacial heat transfer during sub-rapid solidification process of strip casting

Rapid Solidification of Non-Stoichiometric Intermetallic Compounds: Modeling and Experimental Verification

Evolution of interfacial heat transfer, contact behavior and microstructure during sub-rapid solidification of molten steel with different hydrogen contents

A Study of the Interfacial Heat Transfer Between an Iron Casting and A Metallic Mould

Numerical Simulation of Transient Flow and Heat Transfer in a Steel Ladle During Holding Period

Molecular Dynamics Investigation Of The Slip Flow Liquid-Solid Interfacial Thermal Conductance

An Experimental and Numerical Study on the Modelling of Fluid Flow, Heat Transfer and Solidification in a Copper Continuous Strip Casting Process

In Situ Observation and Phase-Field Simulation Framework of Duplex Stainless-Steel Slab during Solidification

Experimental Study on Heat Transfer Boundary Conditions for Steel Hot Extrusion Process

Determination of Interfacial Heat Transfer Behavior at the Metal/Shot Sleeve of High Pressure Die Casting Process of AZ91D Alloy

Influences of Cooling Rates on Solidification and Segregation Characteristics of Fe-Cr-Ni-Mo-N Super Austenitic Stainless Steel

Experimental study of heat-transfer coefficient of Al-Zn-Mg-Cu ultra-thick hot plate during multi-stage quenching

Numerical simulation for heat transfer behavior of copper slag ladle under air-cooling mechanism

Experimental simulation on the continuous casting solidified structure of S32205 duplex stainless steel

Study on the Influence of Surface Roughness and Temperature on the Interface Void Closure and Microstructure Evolution of Stainless Steel Diffusion Bonding Joints

Heat transfer behavior and formation mechanism of stainless steel cladding carbon steel plate during horizontal continuous liquid-solid composite casting

Fast Isothermal Solidification During Transient Liquid Phase Bonding of a Nickel Alloy Using Pure Copper Filler Metal: Solubility vs Diffusivity

Low Temperature Cu/Ga Solid–Liquid Inter-Diffusion Bonding Used for Interfacial Heat Transfer in High-Power Devices