Thin Amorphous Si/Si3n4-Based Light-Emitting Device Prepared With Low Thermal Budget

W. K. Tan,M. B. Yu,Q. Chen,W. Y. Loh,J. D. Ye,X. H. Zhang,G. Q. Lo,D. -L. Kwong
DOI: https://doi.org/10.1109/LED.2007.915379
IF: 4.8157
2008-01-01
IEEE Electron Device Letters
Abstract:This letter reports for the first time on an electrically pumped silicon light-emitting device with a thin multilayer stacked amorphous silicon (a-Si, in thickness of 3 - 7 nm)/silicon nitride (similar to 10 nm) structure. The observed photoluminescence (PL) is tunable from similar to 700 to similar to 670 mn, and intensity increases by decreasing the cc-Si thickness. The PL intensity can be enhanced through postdeposition annealing at relatively low temperatures and a short annealing time (e.g., as optimized at 700 degrees C/10 min). Electroluminescence from devices that are built upon the proposed structure originates from electron-hole pair recombination, and the carrier injection mechanism is through Frenkel - Poole tunneling. Our proposed structure, being highly complimentary metal-oxide-semiconductor compatible, benefits from a low thermal budget process coupled with an accurate layer thickness control.
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