Preparation of Copper Nanoparticles on Carbon Nanotubes by Electroless Plating Method

CL Xu,GW Wu,Z Liu,DH Wu,TT Meek,QY Han
DOI: https://doi.org/10.1016/j.materresbull.2004.04.021
IF: 5.6
2004-01-01
Materials Research Bulletin
Abstract:Densely distributed copper nanoparticles have been deposited on the surface of carbon nanotubes with a size of ∼10nm by the electroless plating method. It has been found that the pretreatment of the carbon nanotubes is very important to obtain the copper nanoparticles on the carbon nanotubes; in our experiments, one-step pretreatment of mixed HNO3 and H2SO4 was found effective. In order to attain nanosized copper particles, the electroless plating parameters should be closely controlled; e.g., the pH value of the plating solution, the temperature, and the concentration and titrating speed of HCOH were critical.
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