Frequency alias analysis and optimization of high frequency ultrasonic transducer for wire bonding application

Zhang Zhen,Meng Fanhao,Liu Zhongwu
DOI: https://doi.org/10.3969/j.issn.1671-3133.2013.08.017
2013-01-01
Abstract:The decrease of the pin pitch and the reduction of the bonding temperature urgently demand higher frequency ultrasonic transducer.The Finite Element Model(FEM) of the ultrasonic transducer working at 135kHz was built by the commercial software ANSYS10.0.The vibrating modes near the working frequency were investigated.Closely to the working mode,there were some un-wanted modes that could be easily excited and would have a great effect on the bonding quality.The size of the transducer was optimized based on sensitivity analysis,and the minimum interval of the frequencies between the working mode and the unwanted modes was increased from 0.7kHz to 4.6kHz,which effectively inhibited the frequency aliasing.At last,the impedance characteristics of the transducer were tested using an impedance analyzer,and the simulation results agreed well with the measured ones.
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