Development and Prospect of Ultrasonic Bonding Transducer

ZHOU Tie-ying
DOI: https://doi.org/10.3969/j.issn.1000-3630.2006.03.018
2006-01-01
Abstract:This paper reviews the development of ultrasonic bonding transducer,specially the development in China.Methods used in the study of ultrasonic bonding transducer are summarized,such as equivalent network,direct solution of the vibration and wave equations,and finite element method(FEM).Programs for the network method have been developed by many researchers,which can be used to calculate frequency and admittance characteristics of long and thin transducers rapidly and accurately.FEM is an effective tool for design and calculation of transducers with complicated structure.A design example is given for a 120 kHz transducer using the above two methods.The range of Qm factor of bonding transducers is shown,which is important for bonding quality.With a comprehensive view on the tremendous need for ultrasonic bonding of micro-electric integrated chips,the prospect of ultrasonic bonding transducer is shown.Stability and reliability of bonding transducers will be a research hotspot.
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