Abstract:Disassembling end-of-life printed circuit boards (PCBs) and reusing the high-value electronic components is an effective way of recycling. During the disassembly process, the quality of components is easily to reduce if the process is inappropriate. A common defect which usually arises in the disassembly process is interfacial delamination within plastic-encapsulated integrated circuits (ICs). The IC delamination is mainly caused by excessive high temperature. Therefore, research of the temperature field of the PCB and the heating strategy is necessary. A peak-temperature principle and a ramp-rate principle are proposed to meet the purpose of heating, i.e. melting the solder sufficiently and avoiding the IC delamination. The peak-temperature principle requires the peak temperature of the PCB should be as low as possible on the premise of melting the solder sufficiently;the ramp-rate principle requires that the ramp-up should be fast at first, and slow when the temperature is approaching the peak temperature. Then a thermal model of PCB heated in multiple temperature zones successively with hot air is built. Combined with this model, a heating strategy is proposed based on the temperature-field uniformity to achieve the temperature profile which conforms to the two heating principles. An experiment is conducted using an independently-developed disassembly machine for end-of-life PCBs to validate the heating strategy. The experimental results show:The PCB temperature field with the fast-then-slow (FTS) ramp from the heating strategy is more uniform than the temperature field with the ramp-to-spike (RTS) which is usually used in reflow process; their component disassembly rate is very close to each other; compared with the RTS ramp, the delamination fraction caused by the disassembly process is 80%lower with the FTS ramp;and thus the proposed heating strategy can effectively reduce IC delamination during the disassembly process.

Investigation into Reusability of Disassembled Chip

Experiments on Reuse-oriented Disassembly of Components from Printed Circuit Boards

Research on delamination failure of plastic ic packages in components reuse processes

Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test

Simultaneous Disassembly of PCBs Based on Components Reusability Assessment

Computational Analysis of Mechanical and Electromigration Reliability Problems

Disassembling Approaches And Quality Assurance Of Electronic Components Mounted On Pcbs

Simulation Research on the Influence of Stress Relaxation on Plastic Ic Delamination During Scrapped Pcb Disassembly

The disassembly process and apparatus of waste printed circuit board assembly for reusing the components

Analysis of Interfacial Peeling in IC Chip Pick-Up Process

Mathematical and Simulation Modelling of Moisture Diffusion Mechanism During Plastic IC Packages Disassembly

Waste Printed Circuit Boards Disassembly Based on Physical Methods and Its Experimental Verification

Heating Strategy for Waste PCB Disassembly Oriented to the Reuse of Disassembled Components

A Combined Simulation and Experimental Study on Cracking and Delamination Behavior at the Cu/Polyimide Interface of RDLs in Chiplet Package Subjected to Thermo-Mechanical Loads

DDR as KGD in 3D-IC M1 Short Failure Analysis

Demolding Defects and the Design of Demolding Device in Micro Hot Embossing Process

Finite Element Analysis on Dry Baking of Plastic IC Components

Interfacial Delamination Characterization and Thermo-mechanical Reliability of Stacked Die Package by Finite Element Analysis

Simulation of Interfacial Delamination Crack of Waste Plastic Chips

The Analysis of Delamination and Fracture in IC Packages

Moisture Assist Delamination In Multiple Die Stacked Package