Abstract:A loop heat pipe is a passive heat transfer device with strong robustness, high efficiency, and good performance, and has been widely utilized in numerous thermal control systems. Herein, an intensive study of a flat-plate evaporator LHP from the perspective of experiment and simulation is presented. First, the vapor leakage problem, which was a common issue for most LHP systems, was solved by filling the assembly clearance with epoxy glue, and a flat-plate LHP system was fabricated to verify its operating performance. Test results indicated that the loop stably performed under various working conditions without temperature oscillation. The maximum heat flux was 11.25 W/cm2 and the minimum thermal resistance was 0.1340 degrees C/W. The heater surface temperature remained low except during the dry-out state in wick at the maximum heat load condition where a sharp increase was observed, and temperature hysteresis occurred during variable heat load tests owing to the transport lag in long liquid line. Based on the above experiment, an efficient 3-D CFD computational model was built to simulate the heat and mass transfer process in a flat-plate evaporator by the Volume of Fluid method. In addition, the flow regime with two-phase distribution at the scale of the entire evaporator was calculated by considering the structure effect. Boundary conditions were derived from the experiment and the mass flow rate at the evaporator inlet was deduced from the heat leakage effect in liquid line. Calculation results demonstrated that four symmetric vortices developed inside the compensation chamber and generated uneven subcooled liquid infiltration in wick, further leading to a slight offset of high-temperature zone to the evaporator inlet side. Parameter analysis indicated that the ribs conducted 84 % of the heat conduction using thermal paths formed between the heater surface and liquid-vapor interface. The vapor volume percentage in the vapor collector was above 80 %, and increasing the heat load reduced the vapor volume in wick as well as the percentage of heat adsorbed during evaporation. Experimental comparison illustrated that the model exhibited a high accuracy with an error less than 10.29 %.

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Experimental Study on A Flat Loop Heat Pipe Coupling the Compensation Chamber and the Condenser

Experimental Study of Heat Transfer Capacity for Loop Heat Pipe with Flat Disk Evaporator

Simulation of heat and mass transfer process in a flat-plate loop heat pipe and experimental comparison

START-UP CHARACTERISTICS OF FLATTEN LOOP HEAT PIPE USING IN LED

Experimental research on the thermal performance of a flat evaporator loop heat pipe with a new composite wick

Research Progress of Loop Heat Pipes for Heat Dissipation of High-Heat-flux Electronic Devices

Experimental Study on an Thermosyphon Loop with Bubble Pump Effect

Numerical investigation on transient and steady phase change heat transfer in the evaporator of a loop heat pipe

Experimental Research on the Heat Performance of a Flat Copper-Water Loop Heat Pipe with Different Inventories

Experimental study on thermal performance of loop heat pipe with a composite-material evaporator for cooling of electronics

Experimental investigation of a loop heat pipe with a flat evaporator and cupric oxide nanofluids as working fluid

Thermal Performance of an Ammonia Loop Heat Pipe Using a Rectangular Evaporator with Liquid-Guiding Channels

Experimental Study on Loop Heat Pipe with Two-Wick Flat Evaporator

A Flow Visualization Study On The Temperature Oscillations Inside A Loop Heat Pipe With Flat Evaporator

Experimental Study of Flat Loop Heat Pipe With Bi-Transport Loops

Experimental Study on the Flat Loop Heat Pipe with Minichannel Wick under Low Heat Flux

Experimental Study of an Ammonia Loop Heat Pipe with a Flat Plate Evaporator

Dynamic modeling of a loop heat pipe with flat evaporator

Experimental investigation on thermal performance of a flat heat pipe

Flat Loop Heat Pipe with Bi-Transport Loops for Graphics Card Cooling