Experimental Study on an Thermosyphon Loop with Bubble Pump Effect

HAN Xiaohong,MIN Xuwei,LI Peng,ZHANG Yujia,CHEN Guangming,WANG Qin
2012-01-01
Abstract:An advanced thermosyphon loop using bubble pump effect was proposed in order to meet the need of the chip heat dissipation at high heat flux.The experiment was conducted to investigate the heat transfer performance of the loop with deionized water as the working fluid at the heat load of 21-646 W and the corresponding heat flux of 1.67-51.4 W/cm2.The experimental results show that although the bubble pump effect will increase the heat transmission resistance and but it can effectively enhance the deionized water turbulence in evaporator cavities,leading to the increases in heat transfer capacity and the critical heat transfer heat flux.Moreover,the minimum thermal resistance was 0.11 ℃/W when the heat load was 646 W,and there was an optimum charging liquid level for the loop.In addition,the charging height was reasonable when the flow pattern was annular flow in the ascending tube,and the evaporation thermal resistance was major part of the overall thermal resistance.These results may be beneficial to further research on chip cooling.
What problem does this paper attempt to address?