Abstract:The increasing complexity of modern very-large-scale integration (VLSI) design highlights the significance of Electronic Design Automation (EDA) technologies. Chip placement is a critical step in the EDA workflow, which positions chip modules on the canvas with the goal of optimizing performance, power, and area (PPA) metrics of final chip designs. Recent advances have demonstrated the great potential of AI-based algorithms in enhancing chip placement. However, due to the lengthy workflow of chip design, the evaluations of these algorithms often focus on intermediate surrogate metrics, which are easy to compute but frequently reveal a substantial misalignment with the end-to-end performance (i.e., the final design PPA). To address this challenge, we introduce ChiPBench, which can effectively facilitate research in chip placement within the AI community. ChiPBench is a comprehensive benchmark specifically designed to evaluate the effectiveness of existing AI-based chip placement algorithms in improving final design PPA metrics. Specifically, we have gathered 20 circuits from various domains (e.g., CPU, GPU, and microcontrollers). These designs are compiled by executing the workflow from the verilog source code, which preserves necessary physical implementation kits, enabling evaluations for the placement algorithms on their impacts on the final design PPA. We executed six state-of-the-art AI-based chip placement algorithms on these designs and plugged the results of each single-point algorithm into the physical implementation workflow to obtain the final PPA results. Experimental results show that even if intermediate metric of a single-point algorithm is dominant, while the final PPA results are unsatisfactory. We believe that our benchmark will serve as an effective evaluation framework to bridge the gap between academia and industry.

An improved benchmark suite for the ISPD-2013 discrete cell sizing contest.

The Ispd-2012 Discrete Cell Sizing Contest And Benchmark Suite

Variation-aware gate sizing and clustering for post-silicon optimized circuits.

Design Time Body Bias Selection for Parametric Yield Improvement.

Modeling and Benchmarking Computing-in-Memory for Design Space Exploration.

A Fast OPC Algorithm for IC Layout Based on 1-D Cells after Optimization of Gap Distribution

A Power Efficient BIST TPG Method on Don't Care Bit Based 2-D Adjusting and Hamming Distance Based 2-D Reordering

Test Power Reduction through Reordering Algorithm Implementation and Advancements in BIST Architecture

Standard Cell Library Evaluation with Multiple lithography-compliant verification and Improved Synopsys Pin Access Checking Utility

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Improving the Process-Variation Tolerance of Digital Circuits Using Gate Sizing and Statistical Techniques

Development and Verification of A Small Cmos Digital Standard Cell Library Based on Smic 130nm Process

Reconfigured Test Architecture Optimization For Tsv-Based Three-Dimensional Socs

Benchmarking End-To-End Performance of AI-Based Chip Placement Algorithms

On-Chip Structures for Fmax Binning and Optimization

SRAM-PG: Power Delivery Network Benchmarks from SRAM Circuits

An Efficient EPIST Algorithm for Global Placement with Non-Integer Multiple-Height Cells

Integrated Test-Architecture Optimization and Thermal-Aware Test Scheduling for 3-D SoCs under Pre-Bond Test-Pin-Count Constraint

Global approach for CMOS circuit optimization by transistor resizing

Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test

Impact Study of Layout-Dependent Effects Toward FinFET Combinational Standard Cell Optimization