Abstract:A new method is proposed to investigate the measurement variation of instruments and their ability to discriminate two TA6V surfaces obtained by grinding with SiC grit papers (80 and 120). Three optical measurement technologies included into a single apparatus, namely Confocal Microscopy (CM), Focus Variation (FV) and Coherence Scanning Interferometry (CSI), were used to measure both ground surfaces according to a specific experimental protocol (MorphoMeca Monitoring) based on measurement iterations and repetitions. From the measurements, four indices were built from the Sa roughness parameter to assess the Quality (ratio of the topographical variability over the measurement noise), the Drift (related to surface fluctuations) and the Stability (estimation of the temporal drift using a second order autoregressive model) of the three measurement technologies (modes), as well as their Relevance (computed from an analysis of variance) to discriminate ground surfaces with close roughness. For these investigated surfaces, it was especially highlighted that the Quality Index is four times higher for the CSI mode than for the FV and CM modes. All the used measurement modes experienced small drifting (Drift Index) during the measurements. The CSI mode was slightly more sensitive to drift than the FV and CM modes. The Stability Index indicated that there was no memory effect between two acquisitions for each measurement mode, i.e., the temporal drift did not depend on the measurement mode. Moreover, the three measurement modes are able to discriminate the two ground surfaces with the same accuracy through the Sa parameter. However, the Sa values may vary depending on the measurement modes, and it was finally shown that the Sa parameter is minimized by 0.03 μm for the FV mode compared with the CSI mode, due to its smoothing effect.

Novel Measurement Technique on 3D Surface Topography of Polishing Pad

Advances of Confocal Microscopy in Three-Dimensional Surface Topography Measurement

A Study on 3D Micro-Topographical Measurement of FRCMC Grinding Surface

Numerical Simulation and Experimental Validation of Fixed Abrasive Grinding Pad Topography

Roughness Characterization of Well-Polished Surfaces by Measurements of Light Scattering Distribution

Study on the Removal Function of Annular Polishing Pad Based on the Computer Controlled Polishing Technology

Measurement of Aspheric Surface

Evaluation on Ground Surface Accuracies of Large-Depth and Steeply Micro-Structured SiC Surfaces

Full Area Covered 3D Profile Measurement of Special-Shaped Optics Based on a New Prototype Non-Contact Profiler.

Afm with the Slope Compensation Technique for High-Speed Precision Measurement of Micro-Structured Surfaces

Measurement of Sub-Surface Microstructures Based on a Developed Ultrasonic Atomic Force Microscopy

Profile Measurements of Micro-Aspheric Surfaces Using an Air-Bearing Stylus with A Microprobe

On-machine Measurement of a Slow Slide Servo Diamond-Machined 3D Microstructure with a Curved Substrate

A novel methodology to assess optical profilometer stability to discriminate surface roughness

Surface Topography Measurement of Mirror-Finished Surfaces Using Fringe-Patterned Illumination

Theoretical and experimental investigations on conformal polishing of microstructured surfaces

In-situ Measurement Technology of Robotic Polishing System

Real Time Measurement of Surface Roughness Using Laser Technique

In-situ Deflectometic Measurement of Transparent Optics in Precision Robotic Polishing

A Novel Simulation Method of Micro-Topography for Grinding Surface.

Research on Surface Topography of Silicon Wafer in Chemical-mechanical Polishing