Abstract:We report here a detailed characterization of the surface chemical states and morphology of polyimide (PI) films following modifications by plasma treatment and electroless copper deposition. NH3 and Ar plasma treatments have been successfully used to achieve morphological and chemical modification of the PI surface so that electroless copper plating can occur. The adhesion strength of the electroless copper to the PI surface was measured and correlated with the plasma-induced chemical and physical modifications of the PI surface. The NH3 plasma causes primarily chemical changes to the PI surface through creation of nitrogen moieties (i.e., –N =C< ) on the surface. The Ar plasma treatment brings about mainly physical changes to the surface (i.e., surface roughening). The combined-plasma treatment (Ar plasma followed by NH3 plasma) combines the desirable chemical and physical effects of each treatment, yielding a PI surface with higher roughness for physical anchoring of the copper and surface bonding sites (nitrogen and oxygen sites). During the electroless copper surface activation step with tin chloride and palladium chloride, tin bonds mainly with the oxygen on the surface, whereas palladium reacts with tin chloride as well as with the surface nitrogen. A direct relationship has been observed between surface palladium concentration and the abundance of the –N =C< sites on the surface. This suggests that the nitrogen radicals created during the NH3 plasma are incorporated into the surface and serve as bonding sites for the palladium. In the subsequent electroless Cu deposition, there was a direct correlation between the palladium surface concentration and Cu coverage. The adhesion strength of the electroless copper to the PI correlated well to the surface modifications and plasma treatment conditions. For the first time, a specific bonding configuration on the PI surface is shown to promote adsorption of palladium, which in turn promotes covalent bonding with Cu. The relative importance of surface roughness and chemical bonding on the adhesion strength is discussed.

Selective Silver Seeding on Laser Modified Polyimide for Electroless Copper Plating

Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole

Selective‐area electroless copper plating on polyimide employing laser patterning of a catalytic film

Selective Metallization on Ordinary Polymer Substrates by Laser Direct Activation of Copper Phosphate or Nickel Phosphate

Electroless Deposition of Confined Copper Layers Based on Selective Activation by Pulsed Laser Irradiation

Direct additive copper plating on polyimide surface with silver ammonia via plasma modification

Fabrication of metallic patterns on ordinary polymer substrates by laser direct activation and electroless plating

Copper Metallization on the Surface-Modified Polyimide Films by Electroless Plating Method

Experiment Study of Laser Thermal Enhanced Electrochemical Deposition

Modification of Cu Nanoparticles with A Disulfide for Polyimide Metallization

Rapid metallization by copper electroplating on insulating substrate using silver nanowires conductive composite as seed layer

Selective metallization of piezoelectric ceramics by laser-induced surface modification combined with electroless copper plating

Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Plasma Graft Copolymerization and UV‐induced Graft Copolymerization with 4‐Vinylpyridine

Plasma Treatment and Surface Analysis of Polyimide Films for Electroless Copper Buildup Process

Electroless Copper Plating Onto Printed Lines of Nanosized Silver Seeds

Polymer Driven Covalently Bonded Decahedral-Twinning of Ag Nanoparticles Prepared by Icp Enhanced Magnetron Sputtering Method

Selective Metallization of Thermoplastic Elastomers Based on Laser‐Induced Surface Activation

Facile process for surface metalization: Rational design of Ag nanoparticle/polymer brush toward high-efficiency electroless plating

Laser-induced localized and maskless electrodeposition of micro-copper structure on silicon surface: Simulation and experimental study

Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns

Effect of Silver Nitrate on Electroless Copper Plating on the Surface of Polyimide Film