One Single Chip Micro Inertial Measurement Unit

CHANG Hong-long,JIANG Qing-hua,CUI Jin-qiang,LI Qian,YUAN Wei-zheng,YANG Fang
DOI: https://doi.org/10.3969/j.issn.1004-1699.2006.05.247
2006-01-01
Abstract:This paper presented one single chip micro inertial measurement unit based on ordinary bulk micromachining process such as dissolved wafer process. The length and width of lateral gaps between the different structure patterns were adjusted to be as similar as possible through comprehensive optimization of the six sensing structures, thus the deep reactive ion etching lag effect could hardly affect the geometry of the structure. The sample chip integrated six inertial sensors, i.e. the X-axis,Y-axis and Z-axis accelerometers and gyroscopes, on one area which was smaller than 1 cm~2. The test results showed that the gyroscopes' bias stability could reach 1 degree per second and the accelerometers' scale factor was about 33 mV/g_n. The study result of the paper proves the feasibility of the simple integration method, which could greatly reduce the size of inertial measure unit.
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