Abstract:Electrodeposition technology is widely used in the surface treatment of copper foil, and the core of this technology is roughening and curing treatment. During the electrodeposition process, the deposited layers often exhibits some problems, such as coarse grain size, uneven thickness and difficult control of crystal morphology. The magnetohydrodynamic (MHD) effect of magnetic field can obviously control the electrodeposition of Cu and improve the micro-morphology and performance of deposited layers. In this paper, Linear Sweep Voltammetry (LSV), Cyclic Voltammetry (CV) and Chronocoulometry (CC) curves were adopted to investigate the electrochemical behavior of deposited Cu in ultra-high acidity sulfate systems under different magnetic field conditions. The nucleation and growth mechanism were discussed, and the micro-morphology of deposited layers was analyzed. The results show that the electrodeposition of Cu follows the three-dimensional (3D) growth mechanism of progressive nucleation and diffusion control under the static condition, and the deposits appear cylindrical shape formed by spherical agglomerated. The magnetic field significantly improves the mass transfer rate, and the deposited layers will be more uniform and dense, following 3D growth mechanism under the electrochemical control. With the increasing of magnetic field intensity, the nucleation mechanism gradually shifts from progressive to transient nucleation. At the early stage of nucleation, the high-intensity magnetic field can significantly increase the number of grains and refine them, obtaining uniform and dense deposited nanolayers.

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