Effect of Protective Atmosphere on Lead-free Electronic Assembly

Bai HAN,Dongyan DING

DOI: https://doi.org/10.3969/j.issn.1005-023X.2013.13.013

2013-01-01

Abstract:The transition of electronic assembly technology from traditional tin-lead to lead-free will bring a big challenge.Using protective atmosphere in electronic assembly can reduce the oxidation of lead-free solders,improve wetting performance and reduce the peak soldering temperature.The typical lead-free solder alloys and controlled atmosphere are briefly introduced.The influence of protective atmosphere on peak temperature,wettability,joint strength of lead-free reflow soldering,and wettability and oxidation slag of lead-free wave soldering are expounded.At last,the orientations of further research in future,such as adding reducing atmosphere and using protective atmosphere economically,are presented.