Impact of Nitrogen on Lead-free Reflow Temperature

冯涛,王豫明

DOI: https://doi.org/10.3969/j.issn.1001-3474.2010.04.002

2010-01-01

Abstract:Nitrogen is an inert gas.The wetting abilities of the soldered surface of component and PCB can be improved in nitrogen atmosghere,at the same time,the oxidization can be reduced,and the soldering reaction can be speeded up.The soldering temperature can be dropped theoretically when the soldering is done in nitrogen atmosghere,and the quality and the reliability of the soldering joint can be kept or improved comparing with the soldering in air.First the oxygen content was set up in reflow oven.Then assumed that the heat capacity was dropped 20 percent above the liquidus temperature in nitrogen atmosghere,and did the reflow soldering,the experiment results showed that the quality and the reliability of the soldering joint are the same as and even higher than the soldering in air.