Directional Solidification of Cu–20Sn Alloy at Low Speed: from Peritectic Coupled Growth to Banding

Dongmei Liu,Xinzhong Li,Yanqing Su,Liangshu Luo,Bo Zhang,Jingjie Guo,Hengzhi Fu

DOI: https://doi.org/10.1016/j.matlet.2011.03.034

IF: 3

2011-01-01

Materials Letters

Abstract:Bridgman-type directional solidification experiments have been carried out in Cu–20Sn peritectic alloy. Peritectic coupled growth and banding structures have been observed at low growth rates (1.5 and 2μm/s) under a temperature gradient up to 40K/mm. The peritectic coupled growth structure, containing rod dendrite primary α phase plus peritectic β phase, forms initially. As solidification proceeds, peritectic coupled growth is overgrown by banding or island banding structures. The formation of banding structure from coupled growth is explained by a model involving Sn concentration change at nucleation of the secondary phase ahead of the solid/liquid interface. It is found that the competitive growth between the α and β phases also plays a critical role on the formation of banding structures.