Thermal Measurement of Power LED by Structure Function

ZHANG Hai-bing,LU Yi-jun,CHEN Huan-ting,LI Kai-hang,GAO Yu-lin,CHEN Zhong,CHEN Guo-long
DOI: https://doi.org/10.3321/j.issn:1005-0086.2009.04.009
2008-01-01
Abstract:As a novel evaluation method,structure function,extracted from the real time thermal transient measurement,was employed to analyze the thermal resistance of power light-emitting diode(LED).Both the thermal resistance of junction to the ambient and those of different layers in the heat-flow path can be obtained from the structure function curves.Based on this heat-flow path map,the package quality and defect location of the device can be evaluated directly and reliably.
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