3D Micro Ablation Technique of Transparent Materials using Deep Ultraviolet Laser

Xu Gang,Cui Jianlei
DOI: https://doi.org/10.3969/j.issn.1000-372X.2009.05.011
2009-01-01
Applied laser
Abstract:Due to the short wavelength and high photon energy,157nm deep-ultraviolet laser is considered as one of important micro ablation tools.In this paper,157nm laser micro ablation mechanism is introduced.For fused silica,the ablation depth and surface roughness are investigated after 157nm laser ablation.Finally,several three-dimensional micro-structures are produced in silica glass chip,which confirmed that 157nm laser is available on manufacturing MOEMS devices.
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