Abstract:The residual stress plays a vital role in determination of the device performance that uses thin films coating and thus the accurate determination of stress and its optimization with process parameters is an ongoing research work for many decades. In line with this, the microscopic origin of the stress at the atomic scale and its development during the thin film deposition is a matter of major scientific interests. The development of stress is a complex phenomenon and has a complex dependence to process parameters, film microstructure and its morphology. In this work, by utilizing a custom-designed cathodic arc deposition system and synchrotron radiation based 2D x-ray diffraction (XRD) technique, we determine the real-time evolution of stress, crystallite sizes and their preferential orientations of Aluminum-Titanium-Nitride (AlxTi1-xN) films with varied Al-content (x=0.0, 0.25, 0.50, and 0.67) on Si-100 substrate. The energies of incoming ions and hence stress in the films is tuned by applying different direct current substrate bias (Vs = floating potential, -20, -40, -60, -80, and -100 V). The instantaneous stress is evaluated by the well-known d vs. sin2{\psi} technique, while crystallite sizes are determined by analyzing line profiles of x-ray diffractograms. The evolution of stress and crystallite sizes are modelled with multiple numerical models from which kinetic parameters associated with the thin film depositions are extracted. The ex-situ microstructure characterizations of AlxTi1-xN coatings are carried out by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The formation of ex-situ microstructure of the films is discussed considering the results obtained from in-situ XRD data. Finally, we demonstrate that the method utilized here is a powerful approach towards estimation of the fracture toughness of thin film coatings.

Intrinsic Stress Analysis of Sputtered Carbon Film

Stress in Amorphous Siox:H Films Prepared by Plasma-Enhanced Chemical Vapor Deposition

Study on the Mechanism and Measurement of Stress of Tio2 and Sio2 Thin-Films

Effects of Applying Stress on the Electron Field Emission Properties in Amorphous Carbon Thin Films

Analysis of stress in TiO2 thin film prepared with ion assisted deposition

Comparative Study of the Tribology of Amorphous Carbon Films Via Magnetron Sputtering Depending on the Different Magnetic Field

Characterizing the Stress and Electrical Properties of Superconducting Molybdenum Films

Film thickness effect on texture and residual stress sign transition in sputtered TiN thin films

Measurement of Residual Stresses in Pulsed Laser Deposited Thin Films

Residual Stress in Sputtered Silicon Oxycarbide Thin Films

In-situ real-time evolution of intrinsic stresses and microstructure during growth of cathodic arc deposited (Al,Ti)N coatings

The estimation of residual stresses by the brittle thin film’s initial cracks on a ductile substrate subjected to tensile stresses

Intrinsic Stress in Evaporated Metal Films

FIB-DIC ring-core measurement of the residual stress on HiPIMS W/Cu and Cr/Cu multilayer thin films

Residual Stress Relief of Hard A-C Films Though Buckling

Residual stress classification of pulsed DC reactive sputtered aluminum nitride film via large-scale data analysis of optical emission spectroscopy

Study of Stress and Morphology of Superconducting Niobium Thin Films

Measurement of residual stresses by X-ray diffraction techniques in pyrite films prepared by magnetron sputtering

The Effect of Stress Relaxation on the Microstructure and Hardness Evolution of Pure Amorphous‐Carbon and C/Ti Multilayer Films

Evaluating Interface Effect On Stresses In Thin Films By A Local Curvature Metrology With High Accuracy And Resolution

Reduction of the Tensile Stress in CoSi2 Films by Pre-Deposition Carbon Ion Implantation