Dispersion of Nanodiamond and Ultra-Fine Polishing of Quartz Wafer

Yongwei Zhu,Zhijing Feng,Baichun Wang,Xianyang Xu
DOI: https://doi.org/10.1016/s1672-2515(07)60046-3
2004-01-01
China PARTICUOLOGY
Abstract:Mechanochemical Modification (MCM) of nanodiamond surface with DN-10 was studied in relation to the performance of nanodiamond in polishing quartz wafers. Results show that the modified nanodiamond is more stable in the pH range 8∼11. A super smooth surface with an average roughness of 0.214 nm was achieved using a nanodiamond-based slurry regulated by N-(2-hydroxyethyl)ethylenediamine. It is suggested that the principal ultra-fine polishing mechanism of quartz wafer involves atom-level removal under the synergism of chemical and mechanical actions.
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